Literature DB >> 33578892

Radiation Tolerance and Charge Trapping Enhancement of ALD HfO2/Al2O3 Nanolaminated Dielectrics.

Dencho Spassov1, Albena Paskaleva1, Elżbieta Guziewicz2, Vojkan Davidović3, Srboljub Stanković4, Snežana Djorić-Veljković5, Tzvetan Ivanov1, Todor Stanchev1, Ninoslav Stojadinović6.   

Abstract

High-k dielectric stacks are regarded as a promising information storage media in the Charge Trapping Non-Volatile Memories, which are the most viable alternative to the standard floating gate memory technology. The implementation of high-k materials in real devices requires (among the other investigations) estimation of their radiation hardness. Here we report the effect of gamma radiation (60Co source, doses of 10 and 10 kGy) on dielectric properties, memory windows, leakage currents and retention characteristics of nanolaminated HfO2/Al2O3 stacks obtained by atomic layer deposition and its relationship with post-deposition annealing in oxygen and nitrogen ambient. The results reveal that depending on the dose, either increase or reduction of all kinds of electrically active defects (i.e., initial oxide charge, fast and slow interface states) can be observed. Radiation generates oxide charges with a different sign in O2 and N2 annealed stacks. The results clearly demonstrate a substantial increase in memory windows of the as-grown and oxygen treated stacks resulting from enhancement of the electron trapping. The leakage currents and the retention times of O2 annealed stacks are not deteriorated by irradiation, hence these stacks have high radiation tolerance.

Entities:  

Keywords:  HfO2/Al2O3 nanolaminates; atomic layer deposition (ALD); charge trapping memories; high-k dielectrics; radiation hardness

Year:  2021        PMID: 33578892      PMCID: PMC7919267          DOI: 10.3390/ma14040849

Source DB:  PubMed          Journal:  Materials (Basel)        ISSN: 1996-1944            Impact factor:   3.623


  6 in total

1.  Investigation of effective media applicability for ultrathin multilayer structures.

Authors:  Johneph Sukham; Osamu Takayama; Maryam Mahmoodi; Stanislav Sychev; Andrey Bogdanov; Seyed Hassan Tavassoli; Andrei V Lavrinenko; Radu Malureanu
Journal:  Nanoscale       Date:  2019-06-24       Impact factor: 7.790

2.  Hole and electron trapping in HfO2/Al2O3 nanolaminated stacks for emerging non-volatile flash memories.

Authors:  D Spassov; A Paskaleva; T A Krajewski; E Guziewicz; G Luka
Journal:  Nanotechnology       Date:  2018-09-27       Impact factor: 3.874

3.  Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping.

Authors:  Albena Paskaleva; Mathias Rommel; Andreas Hutzler; Dencho Spassov; Anton J Bauer
Journal:  ACS Appl Mater Interfaces       Date:  2015-07-30       Impact factor: 9.229

4.  On the Control of the Fixed Charge Densities in Al2O3-Based Silicon Surface Passivation Schemes.

Authors:  Daniel K Simon; Paul M Jordan; Thomas Mikolajick; Ingo Dirnstorfer
Journal:  ACS Appl Mater Interfaces       Date:  2015-12-16       Impact factor: 9.229

Review 5.  Review on Non-Volatile Memory with High-k Dielectrics: Flash for Generation Beyond 32 nm.

Authors:  Chun Zhao; Ce Zhou Zhao; Stephen Taylor; Paul R Chalker
Journal:  Materials (Basel)       Date:  2014-07-15       Impact factor: 3.623

6.  Ta2O5-TiO2 Composite Charge-trapping Dielectric for the Application of the Nonvolatile Memory.

Authors:  C Y Wei; B Shen; P Ding; P Han; A D Li; Y D Xia; B Xu; J Yin; Z G Liu
Journal:  Sci Rep       Date:  2017-07-20       Impact factor: 4.379

  6 in total
  1 in total

1.  New n-p Junction Floating Gate to Enhance the Operation Performance of a Semiconductor Memory Device.

Authors:  Yi-Yueh Chen; Feng-Ming Lee; Yu-Yu Lin; Chih-Hsiung Lee; Wei-Chen Chen; Che-Kai Shu; Su-Jien Lin; Shou-Yi Chang; Chih-Yuan Lu
Journal:  Materials (Basel)       Date:  2022-05-19       Impact factor: 3.748

  1 in total

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