Literature DB >> 33397088

Local Cu Component Engineering to Achieve Continuous Carrier Transport for Enhanced Kesterite Solar Cells.

Yuechao Zhao1, Xiangyun Zhao2, Dongxing Kou1, Wenhui Zhou1, Zhengji Zhou1, Shengjie Yuan1, Yafang Qi1, Zhi Zheng3, Sixin Wu1.   

Abstract

Although the traditional Cu-poor architecture addresses many limitations for Cu2ZnSn(S,Se)4 solar cells, its further development still encounters a bottleneck in terms of efficiency, primarily arising from the inferior charge transport within the quasineutral region and enlarged recombination at back contact. On the contrary, the electrical benign kesterite compound with higher Cu content may compensate for these shortages, but it will degrade device performance more pronouncedly at front contact because of the Fermi level pinning and more electric shunts. Based on the electric disparities on their independent side, in this work, we propose a new status of Cu component by exploring a large grain/fine grain/large grain trilayer architecture with higher Cu content near back contact and lower Cu content near front contact. The benefits of this bottom Cu-higher strategy are that it imposes a concentration gradient to drive carrier diffusion toward front contact and decreases the valence band edge offset in the rear of the device to aid in hole extraction. Also, it maintains the Cu-poor architecture at the near surface to facilitate hole quasi-Fermi level splitting. In return, the local Cu component engineering-mediated electric advances contribute to the highest efficiency of 12.54% for kesterite solar cells using amine-thiol solution systems so far.

Entities:  

Keywords:  Cu2ZnSn(S,Se)4; charge transport; interface recombination; kesterite; thin film solar cells

Year:  2021        PMID: 33397088     DOI: 10.1021/acsami.0c21008

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  2 in total

1.  Kinetics and mechanistic details of bulk ZnO dissolution using a thiol-imidazole system.

Authors:  Kristopher M Koskela; Stephen J Quiton; Shaama Mallikarjun Sharada; Travis J Williams; Richard L Brutchey
Journal:  Chem Sci       Date:  2022-02-25       Impact factor: 9.825

2.  Polymorphic Control of Solution-Processed Cu2SnS3 Films with Thiol-Amine Ink Formulation.

Authors:  Kristopher M Koskela; Carlos Mora Perez; Dmitry B Eremin; Jake M Evans; Marissa J Strumolo; Nathan S Lewis; Oleg V Prezhdo; Richard L Brutchey
Journal:  Chem Mater       Date:  2022-09-21       Impact factor: 10.508

  2 in total

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