| Literature DB >> 33353092 |
David Quirion1, Maria Manna1, Salvador Hidalgo1, Giulio Pellegrini1.
Abstract
This paper provides an overview of 3D detectors fabrication technology developed in the clean room of the Microelectronics Institute of Barcelona (IMB-CNM). Emphasis is put on manufacturability, especially on stress and bow issues. Some of the technological solutions proposed at IMB-CNM to improve manufacturability are presented. Results and solutions from other research institutes are also mentioned. Analogy with through-silicon-via technology is drawn. This article aims at giving hints of the technology improvements implemented to upgrade from a R&D process to a mature technology.Entities:
Keywords: 3D silicon detectors; high-energy physic experiments; process integration; process-induced stress; radiation-hard detectors; silicon manufacturing; through-silicon vias
Year: 2020 PMID： 33353092 PMCID： PMC7766386 DOI： 10.3390/mi11121126
Source DB: PubMed Journal: Micromachines (Basel) ISSN： 2072-666X Impact factor: 2.891