| Literature DB >> 33298884 |
Han Gao1, Haiyan Cai2, Jia Liu3, Xiaoxiao Wang3,4, Pan Zheng5, Martin Devenport5, Ting Xu3,4, Fei Dou6, Yang Liu7, Aiwu Zhou8.
Abstract
Entities:
Year: 2020 PMID: 33298884 PMCID: PMC7606454 DOI: 10.1038/s41421-020-00202-9
Source DB: PubMed Journal: Cell Discov ISSN: 2056-5968 Impact factor: 10.849
Fig. 1Crystal structure of the CTLA-4/HL32-Fab complex.
a Overall structure of the HL32-Fab/CTLA-4 complex. There are a CTLA-4 homodimer and two HL32-Fab molecules in the complex with all four molecules aligned on a same plane. b Close-up view of the binding interface of HL32 and CTLA-4. CTLA-4 binds to the right corner of the front β-sheet of CTLA-4 with CTLA-4 shown as a semi-transparent surface (light blue). The variant heavy chain (VH, pink) and light chain (VL, pale-cyan) of HL32-Fab are shown as cartoon. The CDR1, CDR2, and CDR3 loops of VH are colored in yellow, red, and magenta, respectively. The CDR1, CDR2, and CDR3 loops of VL are colored in green, purple, and cyan, respectively. The MYPPPY motif of CTLA-4 FG loop is colored in blue. c CTLA-4 surface areas covered by B7-1 and various antibodies. The binding areas of B7-1 (PDB: 1I8L), ipilimumab (PDB: 5TRU), tremelimumab (PDB: 5GGV), H11 (PDB: 5E5M), and HL32 (PDB: 6XY2) on the CTLA-4 surface were colored in green, orange, cyan, red, and pink, respectively. The total buried surface area of CTLA-4 in the interface was calculated by PISA. d Superposition of the structures of CTLA-4/B7-1 (PDB: 1I8L) and CTLA-4/HL32-Fab shows potential clashes between B7-1 and HL32. e, f Binding analysis of B7-1 on preformed CTLA-4/antibody complexes. CTLA-4 was first immobilized on a sensor chip and subsequently loaded with ipilimumab or HL32 (stage I). After a brief wash (stage II), the chip was then loaded with B7-1-Fc (stage III) with the sensorgram followed. g Binding characteristics of HL32 and ipilimumab towards CTLA-4 monomer in different pH buffers. Antibodies were anchored on a protein A sensor and monomeric CTLA-4 solutions were flowed over the chip surface with sensorgrams recorded and binding kon and koff rates fitted.