Literature DB >> 33265537

Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis.

Yubing Huang1, Wei Dai1, Lianxi Liu2, Yu Zhao1.   

Abstract

During the assembly process, there are inevitable variations and noise factors in the material properties, process parameters and screening scheme, which may affect the quality of the product. Using the stress-strength model, an evaluated screening scheme method, by analyzing the variation of the defect density in the assembly process, is proposed and discussed. The influence of screening stress on product defects is considered to determine the screening scheme. We performed the defect stream analysis by calculating the recursive relations of residual defect density under multi-stress conditions. We find that the probability density function, which shows the defect changing process from latent to dominant relative to the time process, agrees very well with the historical data. We also calculate the risk as the entropy of the assembly task. Finally, we verify our method by analyzing the assembly process of a certain product.

Entities:  

Keywords:  assembly process; defect stream; entropy; screening evaluation; stress-strength model

Year:  2018        PMID: 33265537      PMCID: PMC7512965          DOI: 10.3390/e20060447

Source DB:  PubMed          Journal:  Entropy (Basel)        ISSN: 1099-4300            Impact factor:   2.524


  2 in total

1.  Improving electronic sensor reliability by robust outlier screening.

Authors:  Manuel J Moreno-Lizaranzu; Federico Cuesta
Journal:  Sensors (Basel)       Date:  2013-10-09       Impact factor: 3.576

2.  FEM Modeling of In-Plane Stress Distribution in Thick Brittle Coatings/Films on Ductile Substrates Subjected to Tensile Stress to Determine Interfacial Strength.

Authors:  Kaishi Wang; Fangzhou Zhang; Rajendra K Bordia
Journal:  Materials (Basel)       Date:  2018-03-27       Impact factor: 3.623

  2 in total

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