| Literature DB >> 33021224 |
Andrei A Gismatulin1, Vitalii A Voronkovskii1, Gennadiy N Kamaev1, Yuriy N Novikov1, Vladimir N Kruchinin1, Grigory K Krivyakin1, Vladimir A Gritsenko1,2,3, Igor P Prosvirin4, Albert Chin5.
Abstract
THe memristor is a key memory element for neuromorphic electronics and new generation flash memories. One of the most promising materials for memristor technology is silicon oxide SiO x , which is compatible with silicon-based technology. In this paper, the electronic structure and charge transport mechanism in a forming-free SiO x -based memristor fabricated with the plasma enhanced chemical vapor deposition method is investigated. The experimental current-voltage characteristics measured at different temperatures in high-resistance, low-resistance and intermediate states are compared with various charge transport theories. The charge transport in all states is limited by the space charge-limited current model. The trap parameters, responsible for the charge transport in a SiO x -based memristor in different states, are determined.Entities:
Year: 2020 PMID: 33021224 DOI: 10.1088/1361-6528/abb505
Source DB: PubMed Journal: Nanotechnology ISSN: 0957-4484 Impact factor: 3.874