Literature DB >> 3299779

Hydrofluoric acid burns.

P Edelman.   

Abstract

Chemical burns sustained in the microelectronics industry consist mostly of injuries to the skin of the hand and face. The injuries are caused by splashes, holes in gloves, or accidental use of a chemical improperly. The chemical burns of the face primarily involve splashes. Employee education and the ability to intervene swiftly are the foundations of prevention of serious injury. Every facility using hydrogen fluoride should be certain that they have current treatment protocols reviewed by someone with expertise in this area. Furthermore, companies should not assume that all local physicians are knowledgeable about hydrogen fluoride and should educate them as well.

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Year:  1986        PMID: 3299779

Source DB:  PubMed          Journal:  Occup Med        ISSN: 0885-114X


  4 in total

Review 1.  Possible hazardous effects of hydrofluoric acid and recommendations for treatment approach: a review.

Authors:  Mutlu Ozcan; Arezo Allahbeickaraghi; Mine Dündar
Journal:  Clin Oral Investig       Date:  2011-11-09       Impact factor: 3.573

2.  Chemical burns causing systemic toxicity.

Authors:  M W Cooke; R E Ferner
Journal:  Arch Emerg Med       Date:  1993-12

Review 3.  A review of hydrofluoric acid burn management.

Authors:  Daniel McKee; Achilleas Thoma; Kristy Bailey; Joel Fish
Journal:  Plast Surg (Oakv)       Date:  2014       Impact factor: 0.947

4.  Environmental and workplace contamination in the semiconductor industry: implications for future health of the workforce and community.

Authors:  P Edelman
Journal:  Environ Health Perspect       Date:  1990-06       Impact factor: 9.031

  4 in total

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