| Literature DB >> 32927772 |
Chen Dong1,2,3, Yi Xu1,3, Ximeng Liu1,3, Fan Zhang1, Guorong He1, Yuzhong Chen1,2.
Abstract
Diverse and wide-range applications of integrated circuits (ICs) and the development of Cyber Physical System (CPS), more and more third-party manufacturers are involved in the manufacturing of ICs. Unfortunately, like software, hardware can also be subjected to malicious attacks. Untrusted outsourced manufacturing tools and intellectual property (IP) cores may bring enormous risks from highly integrated. Attributed to this manufacturing model, the malicious circuits (known as Hardware Trojans, HTs) can be implanted during the most designing and manufacturing stages of the ICs, causing a change of functionality, leakage of information, even a denial of services (DoS), and so on. In this paper, a survey of HTs is presented, which shows the threatens of chips, and the state-of-the-art preventing and detecting techniques. Starting from the introduction of HT structures, the recent researches in the academic community about HTs is compiled and comprehensive classification of HTs is proposed. The state-of-the-art HT protection techniques with their advantages and disadvantages are further analyzed. Finally, the development trends in hardware security are highlighted.Entities:
Keywords: Hardware Trojan; biochip; detection technique; hardware security; integrated circuit; neuromorphic computing; prevention technique; protection technique
Year: 2020 PMID: 32927772 PMCID: PMC7570641 DOI: 10.3390/s20185165
Source DB: PubMed Journal: Sensors (Basel) ISSN: 1424-8220 Impact factor: 3.576
Figure 1The credibility level of a modern IC life cycle.
Figure 2Definition of the HT threat framework in the respective four layers.
Figure 3Threat model of forward error correction (FEC)-based Hardware Trojan (HT) in the wireless network.
Figure 4Schematic diagram of the digital microfluidic biochips (DMFB) structure and path error.
Figure 5Normal flow and unexpected flow in the field-programmable gate array (FPVA) biochip.
Figure 6Threat model of neurons attacked by HTs.
Figure 7Insertion, triggering, and execution for HTs.
Figure 8General structure of a HT in a design.
Figure 9A special HT without trigger.
Figure 10Comprehensive classifications of HTs.
Figure 11HTs detection techniques classifications.
Monitoring properties of four references.
| Monitoring Object | Monitor | Reference |
|---|---|---|
| Tag for packet | Routing computation module | [ |
| Temperature in IC | Extended Kalman filter | [ |
| Risky circuit path | Binary counter, 2 to 1 MUX, | [ |
| A set of concerned signals | Toggle event counter | [ |
Comparison for physical parameters in Side-channel signal analysis.
| Reference | Physical Parameters | Advantage | Disadvantage |
|---|---|---|---|
| [ | Based on thermal | 1. Achieving the detection | Rely on reverse engineering |
| [ | Based on path delay | 1. No changes to the circuit structure | Incomplete interference |
| [ | Based on path delay | 1. Self-reference detection | 1. Excessive area overhead |
| [ | Based emission of light | No damage to chip structure | 1. Limited spatial resolution |
Figure 12Reverse engineering extracts the chip structure images to detect HT.
HTs detection techniques comparision.
| Detection Stage | Detection Technology | Relative Tools | Characteristic Advantages | Existed Problems |
|---|---|---|---|---|
| Pre-Silicon | Facilitate detection | Special circuit components, such as I/O ports and ring oscillators | Enhancing the detection efficiency of side channel detection or logic detection | Additional equipment overhead or circuit area overhead is required, sometimes the circuit design needs to be changed |
| Static detection | Chip netlist | High detection accuracy, flexible in spection operation, no require of standard | It is hard to extract the HT features | |
| IP Verification | IP cores | Prevent the third-party vendors attacking | Limited scale of the detection | |
| Post-Silicon | Optical detection | Picosecond Imaging Circuit Analysis | No need to carry out complicated electrical test and logic test, and the test result is | Highly time consuming for large scale circuits. High resolution for small circuits |
| Logic testing | Automatic test platform | The detection method has high stability and is less affected by noise. It is suitable for HT chips of specific pin-triggered | Large number of measurement vectors, long testing time, limited application range | |
| Side-channel signal analysis | Precision oscilloscope. High precision temperature detector. High-precision power analyzer. High-precision spectrum analyzer and so on | The detection accuracy is high and the limited conditions are less. The HTs are not required to be triggered. As long as the circuit works, the signal can be collected. Be suitable for small scale in tegrated chips | Needing of highprecision equipment, effect of measurement accuracy, needing of standard chip reference. Effect of the external factors | |
| Reverse Engineering | Electronic scanning microscope, Optical scanning microscope, Voltage contrast imager, Circuit Analyzer | High detection accuracy, suitable for simple structure data | The detection time is long, the cost is huge; The chip is damaged, the requirement to the measuring equipment is higher |
HTs prevention techniques comparison.
| Detection Stage | Detection Technology | Characteristic Advantages | Existed Problems |
|---|---|---|---|
| DfT | Layout Filling | HT in self-detection circuit, reducing HT insertion space | Not applicable to integrated cir cuits with complex structure functions, which brings addi tional unnecessary overhead and affects chip performance. Unable to block parametric HT |
| Static detection | Chip netlist | High detection accuracy, flexible in spection operation, no require of standard reference, suitable for VLSI | |
| SMfT | Optical detection | Picosecond Imaging Circuit | No need to carry out complicated |
| Logic testing | Automatic test platform | The detection method has high |
Figure 13The future trend of HT.