Literature DB >> 32580430

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe.

Seonho Seok1, HyungDal Park2, Jinseok Kim2.   

Abstract

This paper presents measurement and FEM (Finite Element Method) analysis of metal adhesion force to a parylene substrate for implantable neural probe. A test device composed of 300 nm-thick gold and 30 nm-thick titanium metal electrodes on top of parylene substrate was prepared. The metal electrodes suffer from delamination during wet metal patterning process; thus, CF4 plasma treatment was applied to the parylene substrate before metal deposition. The two thin film metal layers were deposited by e-beam evaporation process. Metal electrodes had 200 μm in width, 300 μm spacing between the metal lines, and 5 mm length as the neural probe. Adhesion force of the metal lines to parylene substrate was measured with scotch tape test. Angle between the scotch tape and the test device substrate changed from 60° to 90° during characterization. Force exerted the scotch tape was recorded as the function of displacement of the scotch tape. It was found that a peak was created in measured force-displacement curve due to metal delamination. Metal adhesion was estimated 1.3 J/m2 by referring to the force peak and metal width at the force-displacement curve. Besides, the scotch tape test was simulated to comprehend delamination behavior of the test through FEM modeling.

Entities:  

Keywords:  FEM; adhesion; neural probe; parylene; scotch tape test; thin film metal

Year:  2020        PMID: 32580430     DOI: 10.3390/mi11060605

Source DB:  PubMed          Journal:  Micromachines (Basel)        ISSN: 2072-666X            Impact factor:   2.891


  3 in total

Review 1.  Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine.

Authors:  Gaurav Balakrishnan; Jiwoo Song; Chenchen Mou; Christopher J Bettinger
Journal:  Adv Mater       Date:  2022-01-27       Impact factor: 30.849

2.  Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration".

Authors:  Seonho Seok
Journal:  Micromachines (Basel)       Date:  2022-05-09       Impact factor: 3.523

3.  Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

Authors:  Seonho Seok; HyungDal Park; Yong-Jun Kim; Jinseok Kim
Journal:  Micromachines (Basel)       Date:  2022-08-11       Impact factor: 3.523

  3 in total

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