Literature DB >> 32567148

An All-Scale Hierarchical Architecture Induces Colossal Room-Temperature Electrocaloric Effect at Ultralow Electric Field in Polymer Nanocomposites.

Yuqi Chen1, Jianfeng Qian1, Jinyao Yu1, Mengfan Guo1, Qinghua Zhang2, Jianyong Jiang1, Zhonghui Shen1, Long-Qing Chen3, Yang Shen1,4.   

Abstract

Composed of electrocaloric (EC) ceramics and polymers, polymer composites with high EC performances are considered as promising candidates for next-generation all-solid-state cooling devices. Their mass application is limited by the low EC strength, which requires very high operational voltage to induce appreciable temperature change. Here, an all-scale hierarchical architecture is proposed and demonstrated to achieve high EC strength in poly(vinylidene fluoride-trifluoroethylene-chlorofluoroethylene)-based nanocomposites. On the atomic scale, highly polarizable hierarchical interfaces are induced by incorporating BiFeO3 (BFO) nanoparticles in Ba(Zr0.21 Ti0.79 )O3 (BZT) nanofibers (BFO@BZT_nfs); on the microscopic scale, percolation of the interfaces further raises the polarization of the composite nanofibers; on the mesoscopic scale, orthotropic orientation of BFO@BZT_nfs leads to much enhanced breakdown strength of the nanocomposites. As a result, an ultrahigh EC strength of ≈0.22 K m MV-1 is obtained at an ultralow electric field of 75 MV m-1 in nanocomposites filled with the orthotropic composite nanofibers, which is by far the highest value achieved in polymer nanocomposites at a moderate electric field. Results of high-angle annular dark-field scanning transmission electron microscopy, in situ scanning Kelvin probe microscopy characterization, and phase-field simulations all indicate that the much enhanced EC performances can be attributed to the all-scale hierarchical structures of the nanocomposite.
© 2020 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  compound configuration; electrocaloric effect; interfacial polarization; polymer nanocomposites

Year:  2020        PMID: 32567148     DOI: 10.1002/adma.201907927

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  1 in total

1.  Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration.

Authors:  Ming-Ding Li; Xiao-Quan Shen; Xin Chen; Jia-Ming Gan; Fang Wang; Jian Li; Xiao-Liang Wang; Qun-Dong Shen
Journal:  Nat Commun       Date:  2022-10-04       Impact factor: 17.694

  1 in total

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