Anupam Maity1,2, Subha Samanta1,3, Shubham Roy2, Debasish Biswas2, Dipankar Chakravorty1. 1. School of Materials Science, Indian Association for the Cultivation of Science, 2A and 2B Raja S.C. Mallick Road, Kolkata 700032, India. 2. Department of Physics, Jadavpur University, 188 Raja S.C. Mallick Road, Kolkata 700032, India. 3. School of Physical Science, Indian Association for the Cultivation of Science, 2A and 2B Raja S.C. Mallick Road, Kolkata 700032, India.
Abstract
Transparent thin films comprising ultralong (within the range 52-387 μm) copper nanowires with diameter ∼7-9 nm encapsulated in amorphous silica have been successfully fabricated using an electrodeposition technique. The length and number density were controlled by electrodeposition time and concentration of precursor materials, respectively. Giant dielectric constant values (∼1010) obtained from these systems were quantitatively explained as a function of the length of the nanowires on the basis of quantum mechanical theory derived by Rice and Bernasconi. These transparent thin films offer a specific capacitance value of 550 F/g with more than 73% cyclic stability over a period of 900 cycles. Our findings demonstrate a facile pathway to control and improve the properties of metal nanowire-based transparent materials for use in supercapacitor applications.
Transparent thin films comprising ultralong (within the range 52-387 μm) copper nanowires with diameter ∼7-9 nm encapsulated in amorphous silica have been successfully fabricated using an electrodeposition technique. The length and number density were controlled by electrodeposition time and concentration of precursor materials, respectively. Giant dielectric constant values (∼1010) obtained from these systems were quantitatively explained as a function of the length of the nanowires on the basis of quantum mechanical theory derived by Rice and Bernasconi. These transparent thin films offer a specific capacitance value of 550 F/g with more than 73% cyclic stability over a period of 900 cycles. Our findings demonstrate a facile pathway to control and improve the properties of metal nanowire-based transparent materials for use in supercapacitor applications.
The present trend of decrease in the use of traditional fossil
fuels for reducing environmental hazards emanating from their indiscriminate
use and also to be consistent with the trend of miniaturization of
device having light weight have acted as catalysts to develop materials
having large dielectric permittivity. With the increasing growth of
renewable energy manufacturing units, the search for high-energy density
capacitor without compromising on its optical transparency has been
at its peak. Multifunctional nanoscale devices, including transparent
conducting thin films, sensors, capacitors, and energy storage units,
have been fabricated with nanowire composites or thin films.[1,2] Nanowire-based transparent thin film materials which can be used
to create transparent electrodes for use in flat panel display, touch
screen, and transparent supercapacitor have been of importance in
recent times.[2] BaTiO3 nanowires,[3] calcium copper titanate (CaCu3Ti4O12) nanowires,[4] one-dimensional
BiFeO3 nanowires,[5] and polymer
nanocomposites based on carbon nanotube/MnO2 nanowires[6] thin film supercapacitors with the ruthenium
oxide Lipon structure,[7] graphene-based
supercapacitors,[8] porous nickel oxide thin
films,[9,10] nanoporous Ni(OH)2 thin films
on graphite foam,[11] CaCu3Ti4O12 (CCTO) with a dielectric constant value up
to 105 at room temperature[12,13] have been
studied to prepare high dielectric constant materials. The preparation
methods for these materials involve complex reaction mechanisms with
relatively long synthesis time and solid state reactions at high temperatures
(∼1000 °C for 20 h).[14,15] Nanocomposites
and thin films containing gold or silver nanowires have been studied
for high-performance electrode or giant dielectric materials for use
as supercapacitors.[16−18] As compared to silver, copper being more abundant
and inexpensive has emerged as a good alternative. A series of copper-based
nanowires with different morphologies have been synthesized by various
methods.[19−21] In this context, an ultralong copper nanowire has
been explored for the transparent electrode application.[2]Large values of dielectric constant have been reported in suitably
chosen composites of nanomaterials. For example, BaTiO3 nanowires with an aspect ratio of 45.8 were reported to be having
dielectric constant values of 44.3. The latter depended on the filler
concentration and the aspect ratio of the nanowires.[3] Wet chemical synthesis followed by sintering at 1030 °C
resulted in an increase of dielectric constant of CaCu3Ti4O12 (CCTO) up to 105.[12] Such a high dielectric constant found in these
materials was explained on the basis of the Maxwell–Wagner
effect at the interface between the grains and grain boundaries.[22,23] Electrode polarization also plays a crucial role in determining
the dielectric constant of a material.[24]Theoretical calculations by Kubo[25] opened
a new direction by predicting that metallic nanoparticles would have
discrete levels of electronic energy. Following these results, Gorkov
and Eliashberg[26] showed that metallic nanoparticles
will have large electronic polarizability at low temperatures. In
this context, numerous experiments were performed but all showed negative
results because of large depolarizing fields arising from the geometry
of the nanoparticles.[27,28] Rice and Bernasconi proposed
a model incorporating interrupted metallic nanowires which should
exhibit a large dielectric constant but the latter would not be vitiated
by a large depolarizing field.[17,18] Our findings on copper
nanowire-based transparent thin films helped us to achieve the highest
dielectric constant value ∼1010 (at 1 MHz) reported
to the best of our knowledge. Such a high value of dielectric constant
was attributed to the quantum mechanical effect based on the Rice
and Bernasconi model.[29]Several studies regarding the dielectric effect on electrochemical
properties of mixed transition metal oxides have been reported recently.[30] The predominant effect of grain and grain boundary
of the crystallites on the electrochemical properties has been established.[30] CuS nanowire-based electrodes were successfully
developed using a facile liquid–solid chemical oxidation process
and an anion exchange reaction. These electrode materials exhibited
areal capacitance of 378 mF/cm2.[31] Nanoelectrodes comprising the CuS nanowire array on the copper foil
were investigated for capacitive performance, and it showed a specific
capacitance of 305 F/g at room temperature.[32] Cu7S4 nanowire coated on the carbon fiber
fabric was studied as a binder-free electrode for a highly flexible
solid state capacitor.[33] Comparative studies
on capacitive performance of copper-based microstructures were investigated,
and the nanowire Cu(OH)2/Cu foil electrode offers the best
supercapacitive performance with a specific capacitive value of 511.5
F/g.[34] Nanostructured materials comprising
nanowires have attracted attention from scientific community for their
exploitation as more efficient and stable electrodes for use in supercapacitor
applications. Several studies have been carried out on nanowire-based
materials having a high specific capacitance value and good cyclic
stability for use in such applications.[5,16,35] Transparent electrodes based on polyaniline nanowires
were reported as promising electrode materials with excellent capacitive
performance exhibiting a specific capacitance value of 402 F/g.[36] Furthermore, capacitive behavior of NiO nanowire-based
electrodes for the supercapacitor application was investigated depending
on the morphology of the NiO nanostructures. The increased surface
area of NiO nanowire helped to boost the capacitive performance.[37]In this paper, we present a simple synthesis method of making well-aligned
long copper nanowires at room temperature without the requirement
of high annealing temperature. The thin films are transparent, and
they exhibit a specific capacitance value of 550 F/g making them suitable
for use in high-performance supercapacitor applications.
Experimental Section
The schematic for the synthesis procedure of silica-based transparent
thin films containing copper nanowires is outlined, as shown in Figure . A facile sol–gel
method was used to prepare our samples. All chemicals procured from
Sigma-Aldrich with purity 99.99% were used without further purification.
The target thin film compositions were 05 Cu2O–95
SiO2 (thin film-1) and 15 Cu2O–85 SiO2 (thin film-2). Tetraethyl orthosilicate (TEOS) and copper(II)
nitrate trihydrate were used as silica and copper precursors, respectively.
For the synthesis of the abovementioned compositions, calculated amount
of TEOS was mixed with ethanol and stirred for 1 h in a beaker, and
another solution was made by dissolving calculated proportion of copper
nitrate in ethanol followed by stirring for 1 h in a separate beaker.
These two solutions were then mixed and stirred for 7 h at room temperature
to prepare the sol.
Figure 1
Structural schematic representation of silica-based transparent
thin films containing copper nanowires.
Structural schematic representation of silica-based transparent
thin films containing copper nanowires.Commercially available glass slides with dimensions 1 × 1
cm2 (supplied by Blue Star, India) were used as the substrate
to prepare thin film samples. These glass slides were cleaned with
acetone before thin film preparation. The as-prepared sol was spin
coated (using Spin NXG-P1 supplied by Apex Equipment, India) with
1500 rpm for 2 min. The films thus prepared were kept in a desiccator
at room temperature for 3 days.For electrodeposition process, pure copper wires (supplied by KN
Metal Trading Company, India) were used as electrodes and placed on
the surface of the thin film containing Cu2O–SiO2 as the electrolyte (as shown in Figure ). The separation between the electrodes
was ∼6 mm with electrode lengths being ∼10 mm. Ultralong
copper nanowires were formed when a dc voltage was applied across
the electrodes. A constant dc voltage of 5 V magnitude was applied
for different periods of time to grow nanowires of different lengths.
The corresponding current–voltage (I–V) data were collected using the Keithley 2400 SourceMeter
interfaced through LabVIEW program. The current through the samples
increased with time indicating the formation of copper nanowires.[18] The lengths of the nanowires as a function of
electrodeposition time is summarized in Table .
Table 1
Summarized Data of Nanowire Lengths
Associated with Dielectric Constant and Loss Values as a Function
of Electrodeposition Time for All the Samples
sample
average number
of nanowire heads within area of (50 × 50) nm–2 (nd)
time of deposition
(min)
average length
of nanowires (μm)
dielectric
constant at 1 MHz
dielectric
loss at 1 MHz
thin film-1 (05 Cu2O–95 SiO2)
12
15
52
2.2 × 108
0.041
30
53
2.3 × 108
0.043
45
57
2.6 × 108
0.037
thin film-2 (15 Cu2O–85 SiO2)
25
05
183
5.6 × 109
0.019
10
212
7.5 × 109
0.018
15
387
2.5 × 1010
0.011
Characterizations
The samples were characterized by X-ray diffraction patterns using
a Bruker D8 XRD SWAX diffractometer with Cu Kα1 radiation operated
at 40 kV and 40 mA. Atomic force microscopy (AFM) (Veeco model CP
II) was used to find the thickness of the films. The noncontact tapping
mode with a scanning rate of 0.5 Hz was used for data acquisition,
and Proscan IP version 2.0 software was used for analysis and interpretation
of data. The transparencies of the samples were measured using a UV–vis
spectrophotometer (Agilent Technologies Cary 60 UV–vis). The
surface morphology was studied using a field emission scanning electron
microscope (JSM 7500F) operated at 15 kV. The microstructure of nanowires
were further analyzed using a JEM 2010 transmission electron microscope
(TEM) operated at 200 kV. Frequency-dependent dielectric constant
and dissipation factor (tan δ) were measured using an LCR meter
(Agilent E4980A). Cyclic voltammogram (CV) measurement was performed
using a Neware BTS battery tester within the range of −1 to
+1 V at the scan rates of 10, 30, 50, and 70 mV/s. The electrical
measurements were carried out on the samples with the electrodes separated
by a distance ∼6 mm and electrode lengths being ∼10
mm.
Results and Discussion
Figure shows the
comparison of wide-angle X-ray diffraction patterns obtained from
samples before electrodeposition and after electrodeposition of copper
nanowires for thin film-1 and thin film-2. The peak positions from
copper nanowire-based thin films correspond to the (111), (200), and
(220) planes of copper as seen from the standard powder diffraction
card of JCPDS (copper file no. 04-0836). A weak hump at around 22°
reveals the presence of an insulating silica layer[38] which was further confirmed by TEM studies. The silica
layer present in our sample is absolutely amorphous and does not possess
any long-range periodicity. The amorphous nature is revealed by a
weak hump at around 22°, which is in good agreement with JCPDS
data (card no. 01-086-1561). Similar results were identified by other
research groups as the signature of amorphous nature.[39] Also, the absence of any characteristic peaks for silica
reconfirms that the sample did not crystallize and possessed no long-range
periodicity.
Figure 2
Comparison of wide-angle X-ray diffraction patterns obtained from
samples before electrodeposition and after electrodeposition of copper
nanowires for thin film-1 and thin film-2.
Comparison of wide-angle X-ray diffraction patterns obtained from
samples before electrodeposition and after electrodeposition of copper
nanowires for thin film-1 and thin film-2.The film thickness was measured using AFM (Veeco model CP II).
For thickness measurement, the thin film was slashed with a sharp
platinum blade, and the scanning was performed along this edge. A
typical cross-sectional two-dimensional (2-D) image (inset) and the
corresponding height profile of copper nanowire-based thin film-2
are shown in Figure a. Film thickness between the base of a scratch and the flat top
surface of the film was measured at several places, and the average
thickness was estimated to be 380 nm. The corresponding three-dimensional
(3-D) AFM image of the scanned edge is shown in Figure b; some of the small scrap that came out
during the sample preparation process adhered to the surface and is
clearly visible in the 3-D image.
Figure 3
(a) Height profile of copper nanowire-based thin film. Inset shows
cross-sectional 2-D image of the scanned edge. (b) 3-D AFM image obtained
from inset of (a).
(a) Height profile of copper nanowire-based thin film. Inset shows
cross-sectional 2-D image of the scanned edge. (b) 3-D AFM image obtained
from inset of (a).Optical transparency of the copper nanowire-based thin films was
measured using the UV–vis spectra over the optical wavelength
range of 400–750 nm. The transmittance profile is shown in Figure . From figure, it
is seen that these thin films exhibit a high transmittance of around
90% for thin film-1 and 60–80% for thin film-2. Such a high
transparency makes these materials potentially suitable for use as
a transparent supercapacitor.[1,36] The optical images
of the thin films are shown in the inset of Figure .
Figure 4
Transmittance profile of copper nanowire-based thin films. Inset
shows optical images of the thin films.
Transmittance profile of copper nanowire-based thin films. Inset
shows optical images of the thin films.Our facile synthesis procedure helped us to obtain well-aligned
copper nanowires that is revealed in the TEM image of thin film-1,
as shown in Figure . Inset of Figure a shows the disruption in nanowire arising because of a local heating
effect which is further described in the subsequent section. Materials
with high dielectric constant have been found to be limited for practical
utility because of their high loss factors.[15,40] Our results revealed that giant dielectric constant values with
low loss factors can be achieved with ease in the metallic nanowire
system by following this preparation technique. A high-resolution
transmission electron microscopy (HRTEM) image of thin film-1, as
shown in Figure b,
shows the silica layer and the copper nanowire with diameter ≈
7–8 nm.
Figure 5
(a) TEM image of well-aligned copper nanowire obtained from thin
film-1. Inset shows the disruption in nanowire. (b) HRTEM image of
the copper nanowire with the silica layer obtained from thin film-1.
(a) TEM image of well-aligned copper nanowire obtained from thin
film-1. Inset shows the disruption in nanowire. (b) HRTEM image of
the copper nanowire with the silica layer obtained from thin film-1.Figures a–c
and 7a–c show the nanowire array density
of the nanowire heads that were grown across an area of the sample
perpendicular to the nanowire strands for thin film-1 and thin film-2. Figure a–c shows
the variation of the nanowire array density for 15, 30, and 45 min
of deposition time for thin film-1, and Figure a–c shows the variation of the nanowire
array density for 5, 10, and 15 min of deposition time for thin film-2.
These data indicate the high number density of uniformly distributed
copper nanowires in these systems. It is important to note that the
density of the nanowires grown in these systems was related to the
concentration of the copper ions in the starting material. The average
nanowire array density data are summarized in Table which have been used subsequently for the
calculation of dielectric constant values from the theoretical model
of Rice and Bernasconi. Insets of Figures a and 7a show the
selected area electron diffraction (SAED) pattern and HRTEM image
obtained from thin film-1 and thin film-2, respectively. The HRTEM
image led to the identification of copper by measuring the d-spacing values of the lattice planes. The SAED (inset)
confirmed the presence of Cu crystallites correlating it with the
results obtained from HRTEM. The calculated d-spacing
values can be indexed to the (111) planes which is in agreement with
the reported data JCPDS (copper file no. 04-0836). It is to be noted
that although the SAED pattern (Figure a) and HRTEM image (Figure a) were obtained from thin film-1 and thin
film-2, respectively, we can safely conclude that both the Figures a and 7a indeed represent the images of copper nanowire heads, and
additionally SAED pattern reveals the presence of the polycrystalline
phase of copper in these systems.
Figure 6
(a–c) TEM image showing the variation of the nanowire array
density for 15, 30, and 45 min of deposition time for thin film-1.
Inset of (a) shows the SAED pattern obtained from copper nanowire
heads. (d–f) SEM image showing the variation of the nanowire
length for 15, 30, and 45 min of deposition time for thin film-1.
Figure 7
(a–c) TEM image showing the variation of the nanowire array
density for 5, 10, and 15 min of deposition time for thin film-2.
Inset of (a) shows the HRTEM of lattice planes obtained from copper
nanowire heads. (d–f) SEM image showing the variation of the
nanowire length for 5, 10, and 15 min of deposition time for thin
film-2.
(a–c) TEM image showing the variation of the nanowire array
density for 15, 30, and 45 min of deposition time for thin film-1.
Inset of (a) shows the SAED pattern obtained from copper nanowire
heads. (d–f) SEM image showing the variation of the nanowire
length for 15, 30, and 45 min of deposition time for thin film-1.(a–c) TEM image showing the variation of the nanowire array
density for 5, 10, and 15 min of deposition time for thin film-2.
Inset of (a) shows the HRTEM of lattice planes obtained from copper
nanowire heads. (d–f) SEM image showing the variation of the
nanowire length for 5, 10, and 15 min of deposition time for thin
film-2.The ultralong copper nanowires were clearly visible from the scanning
electron microscopy (SEM) images, as shown in Figures d–f and 7d–f,
for thin film-1 and thin film-2. The time of electrodeposition varied
which resulted in the formation of copper nanowires with various lengths.
The controlled growth of copper nanowires showing the variation of
the length for thin film-1 and thin film-2 were evident from SEM images,
as shown in Figures d–f and 7d–f. Figure d–f shows the variation
of the nanowire length for 15, 30, and 45 min of deposition time for
thin film-1, and Figure d–f shows the variation of the nanowire length for 5, 10,
and 15 min of deposition time for thin film-2. The maximum nanowire
length of ∼387 μm was obtained for thin film-2 after
15 min of deposition time. An SEM–energy-dispersive system
(EDS) scanning microscope integrated with automated digital particle
counting and imaging facility was employed to obtain elemental and
material analyses of our samples. Mapping by SEM provides qualitative
information about the distribution of elements shown by different
colors that were present in the scanned area. Figure a shows the area of thin film-2 containing
copper nanowire subjected to elemental mapping, and the resulting
EDS analysis is represented in Figure b. Figure c,e shows the relative positional stoichiometric occupancies
of the constituent elements Cu, O, and Si.
Figure 8
(a) Area of thin film-2 containing copper nanowire subjected to
elemental mapping. (b) Resulting EDS analysis obtained from (a). (c–e)
Relative positional stoichiometric occupancies of the constituent
elements Cu, O, and Si obtained from (a).
(a) Area of thin film-2 containing copper nanowire subjected to
elemental mapping. (b) Resulting EDS analysis obtained from (a). (c–e)
Relative positional stoichiometric occupancies of the constituent
elements Cu, O, and Si obtained from (a).The nonlinear current–voltage (I–V) data for the growth of the nanowires over a time period
of 35 min within thin film-1 and thin film-2 are shown in Figure a,b. The electrochemical
deposition process was performed by applying a dc voltage of 5 V magnitude
across the electrodes for different time periods. It is evident from
this curve that as the time of electrodeposition was increased, the
current through the sample also increased. Initially, the current
increased very slowly for thin film-1 but attained a saturation value
after 33 min, whereas in the case of thin film-2, time taken to reach
the saturation value was 12 min which is much less than the earlier
one. It may also be noted from the I–V data that the maximum current is reached for 15 min of
deposition time for thin film-2, and with further longer deposition
time (>15 min), the current does not change remarkably. Because of
the smaller tip radius of the nanowire, the electric field strength
intensifies which leads to the deposition of copper at the nanowire
tip resulting in the increase of the nanowire length.[41] The further increment in the nanowire length is reflected
by a sharp increase in current. The initial value and maximum magnitude
of current flowing through the samples were found to be larger for
thin film-2. The more available copper ions for thin film-2 made it
easier for the competitive growth rates of metalCu atoms entering
the glass matrix and forming copper nanowires, as compared to thin
film-1.[41,42] The Cu2+ ions drift toward the
cathode under the influence of the applied electric field and get
reduced to form the metallic copper crystal lattice. Initially, few
nanowires started to grow when the available Cu2+ ions
were reduced to form copper nanowires but as the easy availability
of Cu2+ ions was reduced at the vicinity, its growth rate
decreased[41] and then the other copper nanowires
started to grow, thereby increasing the nanowire density over the
electrodeposition time period.
Figure 9
(a) I–V characteristic
for thin film-1 during the electrodeposition process. Inset shows I–V characteristic at the point
of nanowire disruption for thin film-1. (b) I–V characteristic for thin film-2 during the electrodeposition
process. Inset shows I–V characteristic
at the point of nanowire disruption for thin film-2.
(a) I–V characteristic
for thin film-1 during the electrodeposition process. Inset shows I–V characteristic at the point
of nanowire disruption for thin film-1. (b) I–V characteristic for thin film-2 during the electrodeposition
process. Inset shows I–V characteristic
at the point of nanowire disruption for thin film-2.Initially, few nanowires were disrupted at the weak junctions because
of local heating effects. The high current density that may find only
few paths (initially) to flow resulted in a sharp increase of temperature
causing the nanowires to break at the weak junctions and disrupting
the continuity of the nanowires. As and when one nanowire was disrupted,
the other started to form and the current through the sample increased.
This is clearly shown in the inset of the TEM micrograph in Figure a. The process of
disruption of the nanowires is also reflected in the I–V curve; a sharp and sudden decrease of
current is the signature of such a process. I–V characteristics at the point of disruption are shown in
the insets of Figure a,b.Polarization of a dielectric material determines its energy storage
ability. Among four kinds of dielectric polarization (orientational,
interfacial, atomic, and electronic polarization), only atomic and
electronic polarizations predominate at higher frequencies, whereas
all others make their presence felt at lower frequencies.[43]Figure shows the comparison between the variation of dielectric
constant values and the dissipation factor (tan δ) measured
at room temperature over the frequency range of 20 Hz to 1 MHz. It
is evident from the figure that an asymptotic giant dielectric constant
value of ∼2.2 × 108 with a loss factor of 0.04
was obtained for thin film-1, whereas thin film-2 exhibited a dielectric
constant value of ∼2.5 × 1010 with a loss factor
of ∼0.01 at frequencies in the range 1 kHz–1 MHz. The
details are presented in Table . The low dissipation factor is attributed to the masking
of the copper nanowire with an insulating silica layer. Such high
values of dielectric constant (∼1010) at high frequency
with a low value of dissipation factor is reported for the first time
to the best of our knowledge.
Figure 10
(a) Variation of dielectric constant as a function of frequency
for thin film-1, (b) variation of dissipation factor as a function
of frequency for thin film-1, (c) variation of dielectric constant
as a function of frequency for thin film-2, and (d) variation of dissipation
factor as a function of frequency for thin film-2.
(a) Variation of dielectric constant as a function of frequency
for thin film-1, (b) variation of dissipation factor as a function
of frequency for thin film-1, (c) variation of dielectric constant
as a function of frequency for thin film-2, and (d) variation of dissipation
factor as a function of frequency for thin film-2.The dependence of dielectric constant of these materials as a function
of frequency over the abovementioned frequency range (1 kHz–1
MHz) was very low, imparting a high-frequency stability of these materials.
The displacement of negatively charged electron cloud from the positive
charge center with the application of electric field gives rise to
electronic polarization. By this research methodology, we have successfully
designed nanowires having discrete electronic energy levels leading
to enormously enhanced dielectric constant which was explained quantum
mechanically by the Rice–Bernasconi model.[29] The quantum mechanical explanation of static dielectric
constant of the metallic strand system is expressed as[29]where ε is the static dielectric constant
of the system, la is the average length
of the metallic nanowire strands, and qs is the Fermi–Thomas screening wave vector defined as followswhere nd is the
nanowire array density per unit area perpendicular to the strand axis,
and h, uF, and e represent Plank’s constant, electron velocity at
the Fermi level, and electronic charge, respectively. Substituting
the values of e, h, and uF = 1.58 × 108 cm/s for copper[44] in eq , we getUsing the values of nd and la, we have calculated the values of ε
for different thin films which are summarized in Table . These results have been explained
on the basis of the quantum mechanical effect of discrete electronic
energy levels in a macroscopic system which are in good agreement
with the experimentally obtained dielectric constant values for the
two thin film samples studied here. This synthesis procedure and quantum
mechanical explanation can be used to synthesize high-energy density
materials with superior energy storage capacity.Electrochemical performance of the samples for supercapacitor applications
was studied using a conventional two electrode system.[45]Figure a,b shows the CV curves of thin film-1 and thin film-2. The
CV measurements were performed within the voltage range of −1
to +1 V at various scan rates. The specific capacitance value at different
scan rates was obtained using the following equation[45]where m1 = 0.35
mg and m2 = 0.40 mg are the mass of the
active material used for thin film-1 and thin film-2, respectively, k is the scan rate (V/s), and is the integrated area under the CV curve
within the potential window E2 and E1 (i.e., −1 to +1 V) and summarized in Table . The maximum specific
capacitance of 550 F/g was obtained for thin film-2 at a scan rate
of 10 mV/s within the investigated potential window. Although the
scan rate varied over a wide range, the nature of the curve remained
unaltered revealing a near ideal supercapacitor behavior with good
rate capability.[46] The absence of any redox
peak implies the ideal supercapacitor behavior between the copper
nanowire and the residual electrolyte (Cu2O–SiO2). The increase in surface area of copper nanowires with the
increase in nanowire density for thin film-2 rather than thin film-1
contributed to the higher specific capacitance values for these systems.[35,37]
Figure 11
(a) CV curves for thin film-1 and (b) CV curves for thin film-2.
Table 2
Comparative Data of Specific Capacitance
for All the Samples
specific capacitance (F/g)
scan rate (mV/s)
thin film-1 (05 Cu2O–95 SiO2)
thin film-2 (15 Cu2O–85 SiO2)
10
249.28
550.00
20
132.86
241.43
50
102.71
109.71
70
86.12
92.86
(a) CV curves for thin film-1 and (b) CV curves for thin film-2.Figure shows
the percentage capacitive retentivity as a function of cycle number
for thin film-2. The material retains more than 73% of its initial
capacitance even after 900 cycles measured at a scan rate of 50 mV/s.
The negligible decrease in capacitance value even after 900 cycles
indicates its long cycle stability. Inset shows the CV curves at different
cycle numbers at a scan rate of 50 mV/s for thin film-2.
Figure 12
Percentage capacitive retentivity as a function of cycle number
for thin film-2 measured at a scan rate of 50 mV/S. Inset shows the
CV curves at different cycle numbers at a scan rate of 50 mV/S.
Percentage capacitive retentivity as a function of cycle number
for thin film-2 measured at a scan rate of 50 mV/S. Inset shows the
CV curves at different cycle numbers at a scan rate of 50 mV/S.We have carried out further nanostructure engineering of the metallic
nanowire system with a higher concentration of the copper precursor
(20 Cu2O–80 SiO2). We observed that there
was no marked change in the investigated properties, except that the
nanowires formed were thicker in diameter. It was also observed that
the increase in the copper concentration scales down the transparency
of the sample. Therefore, we have achieved an optimized supercapacitive
performance for thin film-2.
Conclusions
Copper nanowires, having diameters in the range 7–9 nm and
lengths in the range 52–387 μm, were synthesized within
an amorphous silica matrix in the system Cu2O/SiO2 using a simple nonaqueous electrodeposition technique. These materials
showed more than 80% transmittance over the optical wavelength range
of 400–750 nm. The density of the nanowires was of the order
of (12–25)/(50 × 50) nm2. The nanowires grown
were interrupted in their configuration. The composites exhibited
very large values of dielectric constant of the order of 1010 in the high-frequency range. This was satisfactorily explained on
the basis of the Rice–Bernasconi model of interrupted metallic
nanowires. Electrochemical measurements revealed nearly ideal capacitive
behavior expressing long cycle stability with a specific capacitance
value of 550 F/g. Therefore, these materials may form the basis for
fabricating transparent and stable thin film supercapacitors with
potential application in energy storage devices.