Literature DB >> 32437128

Tin Selenide Molecular Precursor for the Solution Processing of Thermoelectric Materials and Devices.

Yu Zhang1, Yu Liu2, Congcong Xing1,3, Ting Zhang4, Mengyao Li1, Mercè Pacios1, Xiaoting Yu1, Jordi Arbiol4,5, Jordi Llorca3, Doris Cadavid6, Maria Ibáñez2, Andreu Cabot1,5.   

Abstract

In the present work, we report a solution-based strategy to produce crystallographically textured SnSe bulk nanomaterials and printed layers with optimized thermoelectric performance in the direction normal to the substrate. Our strategy is based on the formulation of a molecular precursor that can be continuously decomposed to produce a SnSe powder or printed into predefined patterns. The precursor formulation and decomposition conditions are optimized to produce pure phase 2D SnSe nanoplates. The printed layer and the bulk material obtained after hot press displays a clear preferential orientation of the crystallographic domains, resulting in an ultralow thermal conductivity of 0.55 W m-1 K-1 in the direction normal to the substrate. Such textured nanomaterials present highly anisotropic properties with the best thermoelectric performance in plane, i.e., in the directions parallel to the substrate, which coincide with the crystallographic bc plane of SnSe. This is an unfortunate characteristic because thermoelectric devices are designed to create/harvest temperature gradients in the direction normal to the substrate. We further demonstrate that this limitation can be overcome with the introduction of small amounts of tellurium in the precursor. The presence of tellurium allows one to reduce the band gap and increase both the charge carrier concentration and the mobility, especially the cross plane, with a minimal decrease of the Seebeck coefficient. These effects translate into record out of plane ZT values at 800 K.

Entities:  

Keywords:  SnSe; molecular ink; nanomaterial; printing; thermoelectricity

Year:  2020        PMID: 32437128     DOI: 10.1021/acsami.0c04331

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  3 in total

Review 1.  Tin-selenide as a futuristic material: properties and applications.

Authors:  Manoj Kumar; Sanju Rani; Yogesh Singh; Kuldeep Singh Gour; Vidya Nand Singh
Journal:  RSC Adv       Date:  2021-02-10       Impact factor: 3.361

2.  Electronic Structure-, Phonon Spectrum-, and Effective Mass- Related Thermoelectric Properties of PdXSn (X = Zr, Hf) Half Heuslers.

Authors:  Bindu Rani; Aadil Fayaz Wani; Utkir Bahodirovich Sharopov; Lokanath Patra; Jaspal Singh; Atif Mossad Ali; A F Abd El-Rehim; Shakeel Ahmad Khandy; Shobhna Dhiman; Kulwinder Kaur
Journal:  Molecules       Date:  2022-10-04       Impact factor: 4.927

Review 3.  Bottom-Up Engineering Strategies for High-Performance Thermoelectric Materials.

Authors:  Qiang Zhu; Suxi Wang; Xizu Wang; Ady Suwardi; Ming Hui Chua; Xiang Yun Debbie Soo; Jianwei Xu
Journal:  Nanomicro Lett       Date:  2021-05-03
  3 in total

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