| Literature DB >> 32192105 |
Dongxu Han1, Kai Yue1, Liang Cheng1, Xuri Yang1, Xinxin Zhang1.
Abstract
A novel method involving the effect of thermal contact resistance (TCR) was proposed using a plane heat source smaller than the measured samples for improving measurement accuracy of the simultaneous determination of in-plane and cross-plane thermal conductivities and the volumetric heat capacity of anisotropic materials. The heat transfer during the measurement process was mathematically modeled in a 3D Cartesian coordinate system. The temperature distribution inside the sample was analytically derived by applying Laplace transform and the variables separation method. A multiparameter estimation algorithm was developed on the basis of the sensitivity analysis of the parameters to simultaneously estimate the measured parameters. The correctness of the algorithm was verified by performing simulation experiments. The thermophysical parameters of insulating materials were experimentally measured using the proposed method at different temperatures and pressures. Fiber glass and ceramic insulation materials were tested at room temperature. The measured results showed that the relative error was 1.6% less than the standard value and proved the accuracy of the proposed method. The TCRs measured at different pressures were compared with those obtained using the steady-state method, and the maximum deviation was 8.5%. The thermal conductivity obtained with the contact thermal resistance was smaller than that without the thermal resistance. The measurement results for the anisotropic silica aerogels at different temperatures and pressures revealed that the thermal conductivity and thermal contact conductance increased as temperature and pressure increased.Entities:
Keywords: anisotropic material; cross-plane thermal conductivity; in-plane thermal conductivity; small-plane heat source; thermal contact resistance
Year: 2020 PMID: 32192105 PMCID: PMC7143132 DOI: 10.3390/ma13061353
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1Schematic diagram: (a) experimental system; (b) the modeled sample and location of thermal contact resistance (TCR).
Thermal–physical properties used in numerical simulations.
| Parameters | Isotropic Material | Anisotropic Materials |
|---|---|---|
| 0.4 | 0.2 | |
| 0.4 | 0.4 | |
| 80 | 80 | |
| 0.05 | 0.05 | |
| 1,599,750 | 1,500,000 | |
| a (m) | 0.02 | 0.02 |
| t (s) | 200 | 200 |
| 150 | 150 | |
| Coordinates ( | (0,0,0.005) | (0,0,0.005) |
Figure 2Comparison between the numerical and analytical solutions: (a) isotropic and (b) anisotropic materials.
Figure 3Results of the parameter sensitivity analysis.
Figure 4Comparison of the increase in temperature between the simulated and estimated results: (a) isotropic material, = 0.03; (b) isotropic material, = 0.05; (c) anisotropic material, = 0.03; and (d) anisotropic material, = 0.05.
Figure 5Schematic of the measurement system. (a) experimental system; (b) heat source plane; (c) samples; (d) high temperature furnace.
Results of verification experiments.
| Sample | ||||
|---|---|---|---|---|
| A | 0.0334 ± 0.0001 | 0.0452 ± 0.0004 | 173.0 ± 1.665 | 1.595 ± 0.0011 |
| B | 0.0528 ± 0.0012 | 0.156 ± 0.00473 | 122.9 ± 1.967 | 3.033 ± 0.0484 |
Experimental results of thermal contact conductivity using the proposed methods and the steady state.
| T (°C) | P (kPa) | Thermal Contact Conductivity (W·m−2·K−1) ± SD | ||
|---|---|---|---|---|
| Proposed Method | Steady-State Method | Deviation (%) | ||
| 200 | 2 | 94.1 ± 0.35 | 102.1 ± 0.45 | 8.5 |
| 5 | 98.5 ± 0.42 | 105.8 ± 0.36 | 7.4 | |
| 8 | 102.4 ± 0.25 | 110.7 ± 0.21 | 8.1 | |
| 300 | 2 | 97.3 ± 0.46 | 104.4 ± 0.71 | 7.3 |
| 5 | 101.9 ± 0.42 | 108.8 ± 0.43 | 6.8 | |
| 8 | 104.8 ± 0.38 | 112.7 ± 0.58 | 7.5 | |
| 400 | 2 | 99.2 ± 0.57 | 105.5 ± 0.65 | 6.4 |
| 5 | 105.7 ± 0.55 | 112.9 ± 0.54 | 6.8 | |
| 8 | 108.9 ± 0.43 | 116.6 ± 0.32 | 7.1 | |
Figure 6Results of experimental measurement at different temperatures: (a) cross-plane thermal conductivity; (b) in-plane thermal conductivity; (c) TCC; and (d) volumetric heat capacity.