| Literature DB >> 32046197 |
Junjie Li1,2, Yongliang Li1, Na Zhou1, Guilei Wang1,2, Qingzhu Zhang1,3, Anyan Du1, Yongkui Zhang1, Jianfeng Gao1, Zhenzhen Kong1, Hongxiao Lin1, Jinjuan Xiang1, Chen Li1,2, Xiaogen Yin1,2, Yangyang Li1,2, Xiaolei Wang1, Hong Yang1, Xueli Ma1, Jianghao Han1, Jing Zhang4, Tairan Hu4, Tao Yang1, Junfeng Li1, Huaxiang Yin1,2, Huilong Zhu1,2, Wenwu Wang1,2, Henry H Radamson1,2,5.
Abstract
Semiconductor nanowires have great application prospects in field effect transistors and sensors. In this study, the process and challenges of manufacturing vertical SiGe/Si nanowire array by using the conventional lithography and novel dry atomic layer etching technology. The final results demonstrate that vertical nanowires with a diameter less than 20 nm can be obtained. The diameter of nanowires is adjustable with an accuracy error less than 0.3 nm. This technology provides a new way for advanced 3D transistors and sensors.Entities:
Keywords: SiGe; atomic layer etching; field effect transistor; nano device; sensor material; vertical nanopillar
Year: 2020 PMID: 32046197 DOI: 10.3390/ma13030771
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623