| Literature DB >> 31936520 |
Yingke Wu1, Jianzhong Ma2, Chao Liu3, Hongxia Yan4.
Abstract
Entities:
Keywords: composites; interfacial interaction; molecular dynamics simulation; surface modification
Year: 2020 PMID: 31936520 PMCID: PMC7023158 DOI: 10.3390/polym12010170
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.329
Figure 1SiO2 nanoparticle without broken bonds on the surface.
Figure 2Molecular model of modifiers: (a). KH550, (b). KH560, (c). KH570 (Gray represents C atom, yellow represents Si atom, white represents H atom, red represents O atom and blue represents N atom).
Figure 3Model of modified-SiO2: (a). KH550-SiO2, (b). KH560- SiO2, (c). KH570-SiO2.
Figure 4Model of PMA-KH570-SiO2.
Figure 5Models for MD simulation of composite system: (a). PMA, (b). PMA/SiO2, (c). PMA/KH550-SiO2, (d). PMA/KH560-SiO2, and (e). PMA/KH570-SiO2.
Figure 6Temperature (a) and energy (b) of PMA/SiO2 nanocomposite at a temperature of 298K during the MD simulation.
Figure 7(a) FT-IR spectrum of SiO2 and modified-SiO2, (b) UV curve of SiO2 and modified-SiO2.
Figure 8SEM images of nano-SiO2 (a). SiO2, (b). KH550-SiO2, (c). KH560-SiO2, (d). KH570-SiO2.
Figure 9TEM images: (a) PMA latex, (b) PMA/SiO2 composite, (c) PMA/KH550-SiO2 composite, (d) PMA/KH560-SiO2 composite, and (e) PMA/KH570-SiO2 composite (Red circles refer to latex particles, yellow circles refer to SiO2 particles).
Figure 10SEM of composite films: (a) PMA, (b) PMA/SiO2, (c) PMA/KH550-SiO2, (d) PMA/KH560-SiO2 and (e) PMA/KH570-SiO2).
Figure 11Effect of fillers on mechanical properties of composite films: (a) Tensile strength, (b) Elongation at break (0. PMA, 1. PMA/SiO2, 2. PMA/KH550-SiO2, 3. PMA/KH560-SiO2 and 4. PMA/KH570-SiO2).
Figure 12(a) Effects of fillers on water vapor permeability and (b) water resistance of composite films (0. PMA, 1. PMA/SiO2, 2. PMA/KH550-SiO2, 3. PMA/KH560-SiO2 and 4. PMA/KH570-SiO2).
Figure 13TGA curve of composite films.
Thermal data of the composite films from TGA analysis.
| Samples | Weight Loss Temperature (°C) | Heat-Resistance Index a (°C) | |
|---|---|---|---|
| T5 | T30 | ||
| 0 | 318.43 | 375.43 | 172.79 |
| 1 | 325.42 | 374.92 | 174.01 |
| 2 | 327.88 | 375.88 | 174.77 |
| 3 | 332.99 | 374.49 | 175.37 |
| 4 | 329.98 | 376.98 | 175.51 |
0. PMA, 1. PMA/SiO2, 2. PMA/KH550-SiO2, 3. PMA/KH560-SiO2 and 4. PMA/KH570-SiO2. a Heat resistance index = 0.49[T5 + 0.6(T30 − T5)]; T5, T30 is the decomposing temperature at 5%, 30% weight loss, respectively.
Binding energy of PMA/SiO2 and PMA/modified-SiO2 composites.
| Systems | |||||
|---|---|---|---|---|---|
| PMA | 10,043.97 | 10,043.97 | - | - | - |
| PMA/SiO2 | −1812.38 | 12,722.97 | −14,260.52 | −274.83 | 274.83 |
| PMA/KH550-SiO2 | −2323.97 | 12,545.98 | −14,552.63 | −317.32 | 317.32 |
| PMA/KH560-SiO2 | −381.20 | 13,785.56 | −13,810.49 | −356.27 | 356.27 |
| PMA/KH570-SiO2 | −1646.98 | - | - | - | - |
Figure 14(a) MSD diagrams of H2O in the PMA, PMA/SiO2, PMA/KH550-SiO2, PMA/KH560-SiO2, and PMA/KH570-SiO2 films during the 40-ps MD duration, (b) The diffusion coefficient (D) of H2O in composite system: 0. PMA, 1. PMA/SiO2, 2. PMA/KH550-SiO2, 3. PMA/KH560-SiO2, and 4. PMA/KH570-SiO2.