The effect of different sealer removal protocols on the bond strength of AH plus-contaminated dentine to a bulk-fill composite.

The integrity of composite bonding for post-endodontic restorations may be compromised by sealer contamination. This study assessed the effect of different sealer removal regimes on the bond strength of dentine to composite resin. Dentine surfaces were contaminated with AH Plus sealer (Dentsply DeTrey, Konstanz, Germany), followed by removal with either dry cotton pellets, cotton pellets saturated with 95% ethanol, AH Plus cleaner or external surface preparation. Dentine surfaces were not contaminated in a positive control group. A bulk-fill composite (SDR; Dentsply) was bonded with Prime&Bond active universal adhesive (Dentsply) onto the prepared surface. Composite resin-dentine beams were produced, and tensile bond strength was determined using a universal testing machine. Using an etch-and-rinse adhesive, bond strengths varied from 21.34 to 29.11 MPa with no statistical differences among removal protocols. In conclusion, contamination by AH Plus sealer does not appear to substantially interfere with bond strength between dentine and a bulk-fill composite/etch-and-rinse system.