| Literature DB >> 31639783 |
Sensen Han1, Aron Chand, Sherif Araby, Rui Cai, Shuo Chen, Hailan Kang, Rongqiang Cheng, Qingshi Meng.
Abstract
Flexible electronics is expected to be one of the most active research areas in the next decade. In this study, a mechanically strong and flexible epoxy/GnP composite film was fabricated having a percolation threshold of electrical conductivity at 1.08 vol% GnPs and high thermal conductivity as 1.07 W m-1 K-1 at 10 vol% GnPs. The composite film shows high mechanical performance: Young's modulus and tensile strength were improved by 1344% and 66.7%, respectively, at 10 vol%. The film demonstrated high sensitivity to various mechanical loads: (i) it has gauge factors of 2 at strain range 0%-7% and 6 at range 7%-10%; (ii) it gives good electrical response with bending and twisting angles up to 180°; and (iii) it displays a good compressive load response up to 2 N where the absolute value of electrical resistance change increased by 71%. Furthermore, the film showed an excellent reliability up to 5.5 × 103 cycles with minor zero-point error. Above 20 °C, the film solely acts as a temperature sensor; upon cyclic temperature testing, the film demonstrated a stable resistive response in the range of 30-75 °C with a temperature sensitivity coefficient of 0.0063 °C-1. This flexible composite film has remarkable properties that enable it to be used as a full-fledged sensor for universal applications in aerospace, automotive and civil engineering.Entities:
Year: 2019 PMID: 31639783 DOI: 10.1088/1361-6528/ab5042
Source DB: PubMed Journal: Nanotechnology ISSN: 0957-4484 Impact factor: 3.874