| Literature DB >> 31615027 |
Michael Versoza1,2, Wonseok Jung3,4, Mona Loraine Barabad5,6, Sangwon Ko7, Minjeong Kim8, Duckshin Park9,10.
Abstract
Although metal contact is known to reduce bacterial growth, the effects of physical barriers and electricity need further investigation. This study examined the bacteria-reducing properties of copper and stainless-steel metal plates with an added electrical current and up to three filter layers on the growth of Escherichia coli (bacteria) and MS2 bacteriophages (virus). When used with a stainless-steel plate, electricity increased bacteria reduction by 39.5 ± 2.30% in comparison with no electricity added, whereas a three-layer physical barrier decreased its efficiency. Copper also reduced the growth of bacteria, by 58.2 ± 8.23%, and the addition of electricity reduced it further (79.5 ± 2.34%). Bacteriophages were also affected by the metal contact. Further experiments showed that MS2 was also reduced by copper, to 82.9 ± 4.5% after 24 h at 37 °C.Entities:
Keywords: Contact-Killing; Filter-Layers; Metal-Plates; bacteria; electricity; virus
Mesh:
Substances:
Year: 2019 PMID: 31615027 PMCID: PMC6843430 DOI: 10.3390/ijerph16203887
Source DB: PubMed Journal: Int J Environ Res Public Health ISSN: 1660-4601 Impact factor: 3.390
Figure 1The conceptual framework of the study (a). All experiments with applied electricity were done on agar plate while the liquid samples were incubated first in liquid solutions before placing in agar plates. Liquid samples and Agar plates are also presented here in detail (b). All samples were incubated in 24 h and PFU counting were done afterwards.
The difference of colony forming units (at Log base 10) between the blank samples and the treated samples with metal plates and filter layers.
| Log Difference | ||||
|---|---|---|---|---|
| Treatment | Filter | |||
| #0 | #1 | #2 | #3 | |
| SS-0 | 0.137 ± 0.02 | 0.111 ± 0.09 | 0.219 ± 0.03 | 0.361 ± 0.02 |
| Cu-0 | 0.379 ± 0.05 | 0.354 ± 0.05 | 0.239 ± 0.09 | 0.308 ± 0.10 |
| SS-Eap | 0.476 ± 0.14 | 0.353 ± 0.14 | 0.348 ± 0.02 | 0.339 ± 0.04 |
| Cu-Eap | 0.688 ± 0.01 | 0.572 ± 0.02 | 0.368 ± 0.13 | 0.242 ± 0.17 |
* Note: Stainless steel and copper with NO electricity added (SS-0, Cu-0) and with added electricity (SS-Eap, Cu-Eap).
Figure 2Inactivation efficiency of the non-applied and applied current experiments.
Figure 3The percentage difference between the applied and non-applied current of metal plates with the influence of filter cloth layers.
Figure 4Colony-forming unit (PFU/mL) between incubation intervals of 7-hrs and 24hrs. Conditions are H: E. coli, H-SS: with stainless-steel, H-Cu: with copper; and V: MS2 Bacteriophages; V-SS: with stainless steel, and V-Cu: with copper.
Colony-forming unit (PFU/mL) of different condition at different incubation time.
| Condition | Incubation Time | % Difference | |
|---|---|---|---|
| 7 h | 24 h | ||
| 1621.9 ± 2.3 | 10935.1 ± 32.4 | 85.2 ± 2.3 | |
| 336.9 ± 10.2 | 9580.9 ± 25.1 | 96.5 ± 2.5 | |
| 247.8 ± 15.2 | 1535.9 ± 35.6 | 83.9 ± 2.6 | |
| 905.6 ± 3.2 | 6940.9 ± 20.3 | 87.0 ± 3.2 | |
| 753.1 ± 45.2 | 1586.1 ± 13.2 | 52.5 ± 5.1 | |
| 550.3 ± 55.2 | 1188.0 ± 65.2 | 53.7 ± 6.5 | |
* % Difference: The difference between 24-h and 7-h incubation time at percentile.
Figure 5Reduction efficiency of liquid samples with metal strips. H-SS: with stainless steel, H-Cu: with copper; and V-SS: with stainless steel, and V-Cu: with copper.