| Literature DB >> 31566951 |
Jinpeng Li1, Bin Wang1, Zhou Ge1, Rui Cheng1, Lei Kang1, Xiaoming Zhou1, Jinsong Zeng1, Jun Xu1, Xiaojun Tian2, Wenhua Gao1, Kefu Chen1, Chaoying Qiu3, Zheng Cheng1.
Abstract
To date, various electronic devices have been strategically fabricated, and simultaneous realization of high electrical conductivity, sensing property, and heat-conducting property by a simple, efficient, and accurate approach is significant but still challenging. Here, cellulosic fiber supported 3D interconnected silver nanowire (AgNW) networks with hierarchical structures are rationally designed to achieve excellent electrical conductivity and superior thermal dispersion capability. In particular, thermal annealing at the junctions enables both phonon and electron transfer as well as impedes interfacial slippage. In the current study, the AgNW/cellulosic paper with the low Ag content (1.55 wt %) exhibits a low sheet resistance of 0.51 Ω sq-1. More importantly, the AgNW/cellulosic paper-based flexible strain sensor has been reasonably developed, which can be applied to monitor various microstructural changes and human motions with high sensitivity and robust stability (fast response/relaxation time of ∼100 ms and high stability >2000 bending-stretching cycles). The AgNW/cellulosic paper-based device also displays efficient thermal dispersion property, which offers exciting opportunities for thermal management application. Furthermore, the obtained hybrid paper exhibits superior heat dispersion capacity for thermal management devices. Overall, uniform dispersion and 3D interconnected junctions of AgNW among the fibers inside the cellulosic papers lead to the combination of high mechanical strength, highly efficient electrical conductivity, and ultrahigh heat dispersion property. The AgNW/cellulosic paper has promising potentials in the flexible and wearable sensing elements, thermal management materials, and artificial intelligence devices.Entities:
Keywords: cellulosic paper; electrical conductivity; silver nanowire; thermal annealing; thermal dispersion
Year: 2019 PMID: 31566951 DOI: 10.1021/acsami.9b13675
Source DB: PubMed Journal: ACS Appl Mater Interfaces ISSN: 1944-8244 Impact factor: 9.229