| Literature DB >> 31461886 |
Charlotte Tripon-Canseliet1, Stephane Xavier2, Yifeng Fu3, Jean-Paul Martinaud4, Afshin Ziaei2, Jean Chazelas4.
Abstract
This paper reports the extraction of electrical impedance at microwave frequencies of vertically aligned multi-wall carbon nanotubes (VA MWCNT) bundles/forests grown on a silicon substrate. Dedicated resonating devices were designed for antenna application, operating around 10 GHz and benefiting from natural inductive/capacitive behavior or complex conductivity in the microwave domain. As obtained from S-parameters measurements, the capacitive and inductive behaviors of VA MWCNT bundles were deduced from device frequency resonance shift.Entities:
Keywords: microwave impedance; multi-wall carbon nanotubes; small antennas
Year: 2019 PMID: 31461886 PMCID: PMC6780677 DOI: 10.3390/mi10090566
Source DB: PubMed Journal: Micromachines (Basel) ISSN: 2072-666X Impact factor: 2.891
Comparison of lineic electrical properties of a 10-nm-diameter cylinder.
| Parameter | Perfect Electrical Conductor (PEC) Wire | Individual MWCNT (Multi-Wall Carbon Nanotube) |
|---|---|---|
| Resistance | 5 mΩ/µm | 7 kΩ/µm |
| Inductance | 1 pH/µm | 20 nH/µm |
| Capacitance | 5 aF/µm | 0.5 fF/µm |
Figure 1Technological process and Characterization of the vertically aligned multi-wall carbon nanotubes (MWCNTs)-based device. (a) SEM (scanning electron microscope) image of CNT bundles grown by Thermal Chemical Vapor Deposition (TCVD) (b) Top view of MWCNTs-based device in CPW (coplanar waveguide) technology under a 125-µm-pitch test probe (optical microscope image).
Figure 2Schematic representation of the complex impedance extraction of VA (vertically aligned) MWCNT bundles from a two-device set.
Figure 3Experimental VA MWCNT bundle impedance extracted from five different CPW devices (C1 to C5) incorporating identical bundle dimensions in the 5–15 GHz frequency band: (a) Real part; (b) Imaginary part.
Figure 4Experimentally extracted VA MWCNT complex conductivity measurements from five microwave devices (C1 to C5) incorporating identical bundle dimensions: (a) Real part; (b) Imaginary part.