| Literature DB >> 31349580 |
Ondřej Kylián1, Artem Shelemin2, Pavel Solař2, Pavel Pleskunov2, Daniil Nikitin2, Anna Kuzminova2, Radka Štefaníková2, Peter Kúš3, Miroslav Cieslar4, Jan Hanuš2, Andrei Choukourov2, Hynek Biederman2.
Abstract
Magnetron sputtering is a well-known technique that is commonly used for the deposition of thin compact films. However, as was shown in the 1990s, when sputtering is performed at pressures high enough to trigger volume nucleation/condensation of the supersaturated vapor generated by the magnetron, various kinds of nanoparticles may also be produced. This finding gave rise to the rapid development of magnetron-based gas aggregation sources. Such systems were successfully used for the production of single material nanoparticles from metals, metal oxides, and plasma polymers. In addition, the growing interest in multi-component heterogeneous nanoparticles has led to the design of novel systems for the gas-phase synthesis of such nanomaterials, including metal/plasma polymer nanoparticles. In this featured article, we briefly summarized the principles of the basis of gas-phase nanoparticles production and highlighted recent progress made in the field of the fabrication of multi-component nanoparticles. We then introduced a gas aggregation source of plasma polymer nanoparticles that utilized radio frequency magnetron sputtering of a polymeric target with an emphasis on the key features of this kind of source. Finally, we presented and discussed three strategies suitable for the generation of metal/plasma polymer multi-core@shell or core-satellite nanoparticles: the use of composite targets, a multi-magnetron approach, and in-flight coating of plasma polymer nanoparticles by metal.Entities:
Keywords: gas aggregation sources; magnetron sputtering; nanoparticles
Year: 2019 PMID: 31349580 PMCID: PMC6696368 DOI: 10.3390/ma12152366
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1(a) Basic system for the deposition of plasma polymer nanoparticles (NPs). (b) Image of Nylon 6,6 with Cu strip. (c) Dual-magnetron system. (d) Setup for in-flight modification of C:H:N:O NPs by silver.
Figure 2(a) Pressure dependences of the deposition rate of C:H:N:O film inside the aggregation chamber and effective deposition rate of C:H:N:O NPs in the main deposition chamber. (b) Pressure dependences of frequency shift on quartz crystal microbalance (QCM) installed into the main deposition chamber. The change in the frequency of quartz crystal is directly proportional to the deposited mass. RF power 40 W.
Figure 3Scanning electron microscopy (SEM) images of C:H:N:O NPs deposited in (a) pure Ar or (b) N2. The presented mean sizes of produced NPs were evaluated from the diameters of 300 individual NPs.
Figure 4(a) High-resolution X-Ray Photoelectron Spectroscopy (XPS) spectra of C 1s peak of NPs deposited in Ar (top) and N2 (bottom) measured by XPS (Phoibos 100, Specs) with an Al Kα X-ray source (1486.6 eV, 200W, Specs). (b) Fourier Transform Infrared Spectroscopy (FT-IR) spectra of NPs deposited in pure Ar (top) and N2 (bottom) recorded by FT-IR (Bruker Equinox 55) in a reflectance-absorbance mode using gold-plated silicon wafers as substrates.
Elemental composition of C:H:N:O NPs deposited using Ar or nitrogen and relative contributions of different bond types, resulting from spectral de-convolution of C 1s peak.
| Working Gas | O | C | N | C-C/C-H | C-O/C-N | C=O/N-C=O | O-C=O |
|---|---|---|---|---|---|---|---|
| Ar | 12 | 76 | 12 | 55 | 37 | 6 | 2 |
| N2 | 6 | 64 | 30 | 23 | 62 | 12 | 2 |
Figure 5(a) Transmission electron microscopy (TEM) image of multi-core@shell Cu/C:H:N:O NPs produced when the composite target was used. (b) UV-Vis spectra of C:H:N:O NPs and heterogeneous Cu/ C:H:N:O NPs. RF power 80 W.
Figure 6(a) Time evolution of intensities of spectral emission lines and bands of Ar, Cu, and CN measured by emission spectrometer (AvaSpec 3648, Avantes) together with the deposition rate of produced NPs. (b) Photography of Nylon/Cu composite target after the plasma operation. RF power 80 W.
Figure 7(a) TEM image of NPs produced when the dual-magnetron Gas Aggregation cluster Source (GAS) system was used. (b) UV-Vis spectra of produced NPs at different DC magnetron currents used for silver sputtering. RF power 40 W.
Figure 8TEM images of Ag/C:H:N:O NPs produced by in-flight sputter deposition of silver onto C:H:N:O NPs. DC magnetron current for silver deposition (a) 100 mA and (b) 300 mA. RF power 40 W.