Literature DB >> 31291172

Initiatives to reduce lead from electronic devices: evidence of success from the toxicity characteristic leaching procedure.

Vicharana Intrakamhaeng1,2, Kyle A Clavier1, Timothy G Townsend1.   

Abstract

Discarded electronic devices (E-waste) have historically been found to exceed US Toxicity Characteristic hazardous waste thresholds for lead. Research was conducted to assess whether global and national lead reduction initiatives in the past decade translate to reduced toxicity characteristic leaching procedure (TCLP) lead leaching from E-waste. Nine categories of devices were subjected to TCLP and in all devices except one (smoke detectors), mean TCLP lead concentration results decreased by an order of magnitude or more (to levels below regulation thresholds). Mean TCLP lead concentrations decreased from 29.1 mg/L (2000-2005) to 0.224 mg/L (2008+) for cell phones and 1.26 mg/L (2000-2005) to 0.060 mg/L (2008+) for PCs. Most recently manufactured electronic devices (of those types tested here) comply with the definition of non-hazardous waste under US regulations. Implications: Discarded electronic devices (E-waste) have often been tested as hazardous waste in the US because of lead leaching. Toxicity characteristic leaching procedure (TCLP) testing on more recently manufactured devices reveals that global lead reduction efforts have resulted in newer devices complying with US non-hazardous waste definitions. While these results highlight the success of lead reduction efforts, they raise policy questions regarding how best to incentivize E-waste recycling going forward.

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Year:  2019        PMID: 31291172     DOI: 10.1080/10962247.2019.1640807

Source DB:  PubMed          Journal:  J Air Waste Manag Assoc        ISSN: 1096-2247            Impact factor:   2.235


  2 in total

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Authors:  Mohsen Mazidi; Richard Kirwan; Ian G Davies
Journal:  J Mol Med (Berl)       Date:  2021-10-18       Impact factor: 4.599

2.  Metal mobility and toxicity of reclaimed copper smelting fly ash and smelting slag.

Authors:  Jiancheng Shu; Tianya Lei; Yaling Deng; Mengjun Chen; Xiangfei Zeng; Renlong Liu
Journal:  RSC Adv       Date:  2021-02-10       Impact factor: 3.361

  2 in total

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