| Literature DB >> 31180626 |
Giovanni Vescio1, Gemma Martín1, Albert Crespo-Yepes2, Sergi Claramunt2, Daniel Alonso2, Julian López-Vidrier3, Sonia Estradé1, Marc Porti2, Rosana Rodríguez2, Francesca Peiró4, Albert Cornet1, Albert Cirera4, Montserrat Nafría2.
Abstract
Low-power, high-performance metal-insulator-metal (MIM) non-volatile resistive memories based on HfO2 high- k dielectric are fabricated using a drop-on-demand inkjet printing technique as a low-cost and eco-friendly method. The characteristics of resistive switching of Pt (bottom)/HfO2/Ag (top) stacks on Si/SiO2 substrates are investigated in order to study the bottom electrode's interaction with the HfO2 dielectric layer and the resulting effects on resistive switching. The devices show low Set and Reset voltages, high ON/OFF current ratio, and relatively low switching current (∼1 μA), which are comparable to the characteristics of current commercial CMOS memories. In order to understand the resistive switching mechanism, direct structural observation is carried out by field-emission scanning electron microscopy (FE-SEM) and high-resolution transmission electron microscopy (HRTEM) on cross-sectioned samples prepared by focused ion beam (FIB). In addition, electron energy loss spectroscopy (EELS) inspections discard a silver electro-migration effect.Entities:
Keywords: TEM; cost-efficient technology; high-k HfO; high-performance resistive switching; inkjet-printed ReRAM
Year: 2019 PMID: 31180626 DOI: 10.1021/acsami.9b01731
Source DB: PubMed Journal: ACS Appl Mater Interfaces ISSN: 1944-8244 Impact factor: 9.229