| Literature DB >> 30959838 |
Jingyu Wang1, Robert Kunkel2,3, Jishan Luo4, Yuhua Li5, Hong Liu6,7, Bradley N Bohnstedt8, Yingtao Liu9, Chung-Hao Lee10,11.
Abstract
Conventional endovascular embolization of intracranial (or brain) aneurysms using helical detachable platinum coils can be time-consuming and occasionally requires retreatment due to incomplete coil packing. These shortcomings create a need for new biomedical devices and methods of achieving brain aneurysm occlusion. This paper presents a biocompatible and highly porous shape memory polymer (SMP) material with potential applications in the development of novel endovascular devices for treating complex intracranial aneurysms. The novel highly porous polyurethane SMP is synthesized as an open cell foam material with a glass transition temperature (Tg) of 39 °C using a sugar particle leaching method. Once heated above the Tg, the compressed SMP foam is able to quickly return to its original shape. An electrical resistance heating method is also employed to demonstrate a potential triggering design for the shape recovery process in future medical applications. The mechanical properties of the developed SMP foam are characterized at temperatures up to 10 °C above the respective Tg. The results from this work demonstrate that the porous SMP material developed in this study and the electrical resistance heating trigger mechanism provide a solid foundation for future design of biomedical devices to enhance the long-term therapeutic outcomes of endovascular intracranial aneurysm treatments.Entities:
Keywords: electrical resistance heating; glass transition temperature; micro-CT; polyurethane; porous architecture; shape memory; shape recovery activation; thermo-mechanical properties
Year: 2019 PMID: 30959838 PMCID: PMC6523242 DOI: 10.3390/polym11040631
Source DB: PubMed Journal: Polymers (Basel) ISSN: 2073-4360 Impact factor: 4.329
Figure 1Schematic of the sugar particle leaching method for fabrication of the porous shape memory polymer (SMP) foam.
Figure 2(a) Experimental photo of the electrically-heated procedure to activate the shape recovery of the SMP foam using carbon fiber wires. (b) Image of the experimental setup in thermal chamber for mechanical characterization of the SMP foam.
Figure 3Progression of the shape recovery process of the compressed porous SMP foam in response to direct heating above the SMP’s Tg.
Figure A2Shape recovery of the bent solid SMP beam (temporary shape) into the originally programmed straight shape after heating above the SMP’s Tg.
Figure 4SEM images taken from the top layer and the middle layer of the porous SMP foam fabricated using the sugar particle leaching method, showing the open-cell structure of the foam.
Figure A1Micro-CT images showing the microstructure of SMP foam: (a) 2D image slices on orthogonal planes, (b) zoom-in area of the 2D image slice on the x-y plane, demonstrating the typical pore sizes of the SMP foam, and (c) the visualization of the reconstructed 3D geometry of the cubic SMP foam (10 mm by 10 mm by 10 mm).
Figure 5Surface temperature of the SMP foam specimen at various applied electric current magnitudes during the electrical resistance heating.
Figure 6Experimental photos of the shape recovery process of the compressed SMP foam under 0.15 A DC, along with the measured surface temperature profile via an IR camera at 140 s after the applied electric current.
Figure 7Mechanical characterizations of the fabricated SMP foam under the cyclic compressive loading conditions: (a) the typical mechanical response of the SMP foam at room temperature; (b) representative mechanical responses of the SMP foam at Tg and Tg + 10 °C under cyclic compressive loading, and (c) comparison of the maximum stress at the 35% strain for various loading cycles at Tg and Tg + 10 °C. Values are reported as mean ± SEM (standard error of the mean; n = 3).