Literature DB >> 30762268

Recent Progress in Aromatic Polyimide Dielectrics for Organic Electronic Devices and Circuits.

Deyang Ji1,2, Tao Li3, Wenping Hu4, Harald Fuchs1,2.   

Abstract

Polymeric dielectrics play a key role in the realization of flexible organic electronics, especially for the fabrication of scalable device arrays and integrated circuits. Among a wide variety of polymeric dielectric materials, aromatic polyimides (PIs) are flexible, lightweight, and strongly resistant to high-temperature processing and corrosive etchants and, therefore, have become promising candidates as gate dielectrics with good feasibility in manufacturing organic electronic devices. More significantly, the characteristics of PIs can be conveniently modulated by the design of their chemical structures. Herein, from the perspective of structure optimization and interface engineering, a brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided. Also, an outlook of future research directions and challenges for polyimide dielectric materials is presented.
© 2019 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  aromatic polyimides; circuits; interface engineering; organic electronic devices; polymeric dielectrics

Year:  2019        PMID: 30762268     DOI: 10.1002/adma.201806070

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  8 in total

Review 1.  Chiral Graphene Hybrid Materials: Structures, Properties, and Chiral Applications.

Authors:  Biao Zhao; Shenghua Yang; Jianping Deng; Kai Pan
Journal:  Adv Sci (Weinh)       Date:  2021-02-12       Impact factor: 16.806

Review 2.  Recent Progress in Materials Chemistry to Advance Flexible Bioelectronics in Medicine.

Authors:  Gaurav Balakrishnan; Jiwoo Song; Chenchen Mou; Christopher J Bettinger
Journal:  Adv Mater       Date:  2022-01-27       Impact factor: 30.849

3.  Simultaneously Improving the Optical, Dielectric, and Solubility Properties of Fluorene-Based Polyimide with Silyl Ether Side Groups.

Authors:  Yancheng Wu; Shumei Liu; Jianqing Zhao
Journal:  ACS Omega       Date:  2022-04-01

4.  Colorless Semi-Alicyclic Copolyimides with High Thermal Stability and Solubility.

Authors:  Zhongxu Lan; Chunyu Li; Yanlei Yu; Jia Wei
Journal:  Polymers (Basel)       Date:  2019-08-07       Impact factor: 4.329

5.  Adhesion Optimization between Incompatible Polymers through Interfacial Engineering.

Authors:  Fatemeh Mashayekhi; Julien Bardon; Stephan Westermann; Frédéric Addiego
Journal:  Polymers (Basel)       Date:  2021-12-07       Impact factor: 4.329

6.  Scalable self-assembly interfacial engineering for high-temperature dielectric energy storage.

Authors:  Chao Wu; Anna Marie LaChance; Mohamadreza Arab Baferani; Kuangyu Shen; Zongze Li; Zaili Hou; Ningzhen Wang; Yifei Wang; Luyi Sun; Yang Cao
Journal:  iScience       Date:  2022-06-11

7.  Effect of Epoxidized and Maleinized Corn Oil on Properties of Polylactic Acid (PLA) and Polyhydroxybutyrate (PHB) Blend.

Authors:  Jaume Sempere-Torregrosa; Jose Miguel Ferri; Harrison de la Rosa-Ramírez; Cristina Pavon; Maria Dolores Samper
Journal:  Polymers (Basel)       Date:  2022-10-07       Impact factor: 4.967

8.  Fluorinated Linear Copolyimide Physically Crosslinked with Novel Fluorinated Hyperbranched Polyimide Containing Large Space Volumes for Enhanced Mechanical Properties and UV-Shielding Application.

Authors:  Qing Li; Ronghua Chen; Yujuan Guo; Fuhou Lei; Zushun Xu; Hui Zhao; Guangfu Liao
Journal:  Polymers (Basel)       Date:  2020-01-03       Impact factor: 4.329

  8 in total

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