Quantitative traceable temperature measurement using novel thermal imaging camera.

Conventional thermal imaging cameras, based on focal-plane array (FPA) sensors, exhibit inherent problems: such as stray radiation, cross-talk and the calibration uncertainty of ensuring each pixel behaves as if it were an identical temperature sensor. Radiation thermometers can largely overcome these issues, comprising of only a single detector element that can be optimised and calibrated. Although the latter approach can provide excellent accuracy for single-point temperature measurement, it does not provide a temperature image of the target object. In this work, we present a micromechanical systems (MEMS) mirror and silicon (Si) avalanche photodiode (APD) based single-pixel camera, capable of producing quantitative thermal images at an operating wavelength of 1 µm. This work utilises a custom designed f-theta wide-angle lens and MEMS mirror, to scan +/- 30° in both x- and y-dimensions, without signal loss due to vignetting at any point in the field of view (FOV). Our single-pixel camera is shown to perform well, with 3 °C size-of-source effect (SSE) related temperature error and can measure below 700 °C whilst achieving ± 0.5 °C noise related measurement uncertainty. Our measurements were calibrated and traceable to the International Temperature Scale of 1990 (ITS-90). The combination of low SSE and absence of vignetting enables quantitative temperature measurements over a spatial field with measurement uncertainty at levels lower than would be possible with FPA based thermal imaging cameras.