Literature DB >> 30441113

Chronically Implantable Package Based on Alumina Ceramics and Titanium with High-density Feedthroughs for Medical Implants.

Hangao Yang, Tianzhun Wu, Saisai Zhao, Shanshan Xiong, Bo Peng, Mark S Humayun.   

Abstract

Implantable package to hermetically encapsulate electronics inside human body is critical for active implant devices such as neuroprothesestextbf. To meet the demanding package requirement for smaller size and higher feedthrough density, we propose a high-density (100+ feedthroughs for 10 mm diameter) ceramic/metal composite package with helium leakage rate on the 10-10 Pa m3/s, at the same time possessing the best cytotoxicity level of Grade 0, which enable the chronic implant in human. Pure alumina substrate co-sintered with platinum (Pt) paste filled in micrometer holes have demonstrated extremely good hermetical seal and biocompatibility, then its braze joint with a titanium(Ti) ring was achieved, followed by the laser welding with a Ti cap. Standard helium leakage rate and cytotoxicity experiments have shown each component and joint interface are qualified for 100-year chronic implant, which is significant for various active implant instruments.

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Year:  2018        PMID: 30441113     DOI: 10.1109/EMBC.2018.8513004

Source DB:  PubMed          Journal:  Annu Int Conf IEEE Eng Med Biol Soc        ISSN: 2375-7477


  3 in total

1.  A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation.

Authors:  HyungDal Park; Wonsuk Choi; Seonghwan Oh; Yong-Jun Kim; Seonho Seok; Jinseok Kim
Journal:  Micromachines (Basel)       Date:  2022-03-26       Impact factor: 3.523

Review 2.  Micro/Nano Technologies for High-Density Retinal Implant.

Authors:  Qi Zeng; Saisai Zhao; Hangao Yang; Yi Zhang; Tianzhun Wu
Journal:  Micromachines (Basel)       Date:  2019-06-22       Impact factor: 2.891

3.  Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

Authors:  Seonho Seok; HyungDal Park; Yong-Jun Kim; Jinseok Kim
Journal:  Micromachines (Basel)       Date:  2022-08-11       Impact factor: 3.523

  3 in total

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