| Literature DB >> 30397650 |
Sun Dal Kim1, Byungyong Lee1, Taejoon Byun1, Im Sik Chung2, Jongmin Park3, Isaac Shin3, Nam Young Ahn3, Myungeun Seo1,3, Yunho Lee1, Yeonjoon Kim1, Woo Youn Kim1, Hyukyun Kwon4, Hanul Moon4, Seunghyup Yoo4, Sang Youl Kim1.
Abstract
The key component currently missing for the next generation of transparent and flexible displays is a high-performance polymer material that is flexible, while showing optical and thermal properties of glass. It must be transparent to visible light and show a low coefficient of thermal expansion (CTE). While specialty plastics such as aromatic polyimides are promising, reducing their CTE and improving transparency simultaneously proved challenging, with increasing coloration the main problem to be resolved. We report a new poly(amide-imide) material that is flexible and displays glass-like behavior with a CTE value of 4 parts per million/°C. This novel polymer was successfully used as a substrate to fabricate transparent and flexible indium-gallium-zinc oxide thin-film transistors.Entities:
Year: 2018 PMID: 30397650 PMCID: PMC6203221 DOI: 10.1126/sciadv.aau1956
Source DB: PubMed Journal: Sci Adv ISSN: 2375-2548 Impact factor: 14.136
Fig. 1Transparent and thermostable poly(amide-imide)s with low CTE.
(A) Synthetic route to PAIs. (B) Photo of PAI(s-u) freestanding film. Photo credit: Byungyong Lee. (C) Relationship of transmittance and CTE as a function of u diamine content in the PAI.
Characterization of PAIs.
| PAI( | 0.00 | 3.76 | 371 | 88 | 457 | 432 | 8.7 | 9.5 |
| PAI( | 0.25 | 3.90 | 371 | 88 | 468 | 474 | 6.1 | 7.4 |
| PAI( | 0.25 | 2.90 | 364 | 88 | 497 | 479 | 5.6 | 5.2 |
| PAI( | 0.50 | 3.98 | 371 | 88 | 478 | 484 | 4.2 | 4.4 |
| PAI( | 0.50 | 3.02 | 371 | 89 | 485 | 486 | 4.6 | 5.7 |
| PAI( | 0.50 | 3.40 | 371 | 88 | 482 | 492 | 4.8 | 4.8 |
| PAI( | 0.75 | 3.62 | 371 | 88 | 511 | 496 | 5.6 | 6.1 |
| PAI( | 1.00 | 3.50 | 371 | 88 | 465 | 476 | 7.5 | 7.6 |
*Molar fraction of uDA-originated repeating units in the total diamine content.
†Inherent viscosity measured in NMP at 0.5 g dl−1 concentration at 30°C.
‡Cutoff wavelength determined by UV-vis spectra of freestanding polymer films 70 to 80 μm thick.
§Transmittance at 550 nm.
║5% weight loss temperature measured by TGA at a heating rate of 10°C/min.
¶Calculated from the mean coefficient of linear thermal expansion between 50° and 250°C in the second and third heating runs, respectively.
Fig. 2Analysis of thermal expansion behavior of poly(amide-imide)s.
(A) Representative 2D GIWAXS data of the PAI(s-s), PAI(s-u), PAI(u-s), and PAI(u-u). (B) Azimuthal profile in the q direction, which was deconvoluted assuming Gaussian functions. arb. units, arbitrary units. (C) A plot of π-π stacking distance versus u(u + s). (D) A plot of CTE versus π-π stacking distance.
Fig. 3Optimized structures of poly(amide-imide)s’ repeating units.
Optimized structures of PAI(s-s) (A), PAI(s-u) (B), PAI(u-s) (C), and PAI(u-u) (D) repeating units by DFT calculations. Their corresponding binding energies are also given. The red dotted lines indicate hydrogen bonds. The π-π stacking structures between two biphenyl units along with the distances between two phenyl rings are separately shown on the right side.
Fig. 4TFT device fabricated on poly(amide-imide) film.
(A) Schematic structure of the transparent and flexible IGZO TFT fabricated on PAI(s-u). (B and C) Electrical characteristics (B) and transmittance spectra (C) of the IZGO TFTs. (D) TFT performance as a function of bending radius.