| Literature DB >> 30300824 |
Misa Hayashida1, Kai Cui2, Amin Morteza Najarian3, Richard McCreery4, Neerushana Jehanathan5, Chris Pawlowicz5, Sohei Motoki6, Masahiro Kawasaki7, Yuji Konyuba6, Marek Malac8.
Abstract
We report, for the first time, the three dimensional reconstruction (3D) of a transistor from a microprocessor chip and roughness of molecular electronic junction obtained by electron tomography with Hole Free Phase Plate (HFPP) imaging. The HFPP appears to enhance contrast between inorganic materials and also increase the visibility of interfaces between different materials. We demonstrate that the degree of enhancement varies depending on material and thickness of the samples using experimental and simulation data.Keywords: Electron tomography; Hole free phase plate (HFPP); Interface roughness; Molecular electronic junction; Transistor imaging; Transmission electron microscope (TEM)
Year: 2018 PMID: 30300824 DOI: 10.1016/j.micron.2018.09.005
Source DB: PubMed Journal: Micron ISSN: 0968-4328 Impact factor: 2.251