| Literature DB >> 30250806 |
Ziyu Lv1,2, Yan Wang1, Zhonghui Chen3, Long Sun4, Junjie Wang1, Meng Chen5, Zhenting Xu5, Qiufan Liao6, Li Zhou1, Xiaoli Chen1, Jieni Li6, Kui Zhou1, Ye Zhou5, Yu-Jia Zeng6, Su-Ting Han1, Vellaisamy A L Roy2.
Abstract
Phototunable biomaterial-based resistive memory devices and understanding of their underlying switching mechanisms may pave a way toward new paradigm of smart and green electronics. Here, resistive switching behavior of photonic biomemory based on a novel structure of metal anode/carbon dots (CDs)-silk protein/indium tin oxide is systematically investigated, with Al, Au, and Ag anodes as case studies. The charge trapping/detrapping and metal filaments formation/rupture are observed by in situ Kelvin probe force microscopy investigations and scanning electron microscopy and energy-dispersive spectroscopy microanalysis, which demonstrates that the resistive switching behavior of Al, Au anode-based device are related to the space-charge-limited-conduction, while electrochemical metallization is the main mechanism for resistive transitions of Ag anode-based devices. Incorporation of CDs with light-adjustable charge trapping capacity is found to be responsible for phototunable resistive switching properties of CDs-based resistive random access memory by performing the ultraviolet light illumination studies on as-fabricated devices. The synergistic effect of photovoltaics and photogating can effectively enhance the internal electrical field to reduce the switching voltage. This demonstration provides a practical route for next-generation biocompatible electronics.Entities:
Keywords: Kelvin probe force microscopy; carbon dots; charge trapping; resistive switching; silk
Year: 2018 PMID: 30250806 PMCID: PMC6145401 DOI: 10.1002/advs.201800714
Source DB: PubMed Journal: Adv Sci (Weinh) ISSN: 2198-3844 Impact factor: 16.806
Figure 1Materials characteristics. a) Fourier transform infrared spectroscopy‐attenuated total reflectance (FTIR‐ATR) spectrum of amide I and amide II region of silk protein thin film, the yellow ribbon indicates the characteristic vibration peak of silk protein: δC = O. b) Circular dichroism spectrum of silk protein in aqueous solution (concentration: 0.05 mg mL−1). c) TEM images of pristine CDs. The inset is the fast Fourier transform pattern of CDs. Scale bar: 50 nm. d) AFM topographic images of pristine CDs on a mica substrate. Scale bar: 40 nm. e) UV–vis spectrum of CDs aqueous solution (concentration: 0.05 mg mL−1). f) Fluorescence spectra of CDs aqueous solution (concentration: 0.003 mg mL−1) at different excitation wavelengths. Inset: Photographs and schematic illustration of CDs solution before and after UV light irradiation (λ: 365 nm). g) AFM topographic images of CDs‐silk composite film on a mica substrate. Scale bar: 300 nm.
Figure 2Device fabrication, structure, and I–V characteristics. a) Schematic illustration depicting the fabrication process of the flexible CDs‐silk memory devices. b) Cross‐sectional SEM image of the device structure. Scale bars: 100 nm. c–e) I–V characteristics of CDs‐silk memories with c) Al, d) Au, and e) Ag top electrode at different positive compliance current (dark, sweeping rate: 50 mV). f) Contact potential difference images from KPFM measurement of CDs‐silk film, Al surface, Au surface, and Ag surface. g–i) I–V characteristics of CDs memories with g) Al, h) Au, and i) Ag top electrode, exposed to UV light (λ = 365 nm) with intensity from 0 to 0.15 mW cm−2 (sweeping rate: 50 mV). j) Experimental data and fitted lines of the I–V characteristics of the Al/CDs‐silk/ITO device at SET process without light irradiation (compliance current: 1 mA).
Figure 3Device statistics and endurance. a) Distribution of SET voltages without (left) and with (right) UV light treatment (100 sample devices for both statistics histograms). The black lines are Gaussian fits to the distributions. Histogram of the ON and OFF current b) without and c) with light irradiation. The black lines are Gaussian fits to the histogram. d–f) The stability ON and OFF current of CDs‐silk memories with d) Al, e) Au, and f) Ag top electrode. The devices were measured with constant application read voltage at 300 K.
Figure 4Charge trapping capability of CDs‐silk film detected by KPFM. a) Schematic representation of experimental setup for 2D injection of electrons or holes into CDs‐silk film in a contact mode, as well as subsequent surface potential measurement in a KPFM mode. A Pt/Ir‐coated conductive tip was used. (Charge injection area: 1 µm; tip bias: ‐6 V or +6 V; charge injections into CDs‐silk film without or with light were conducted by the same method; UV light intensity: 0.15 mW cm−2.) Surface potential images of b) CDs‐silk layer and c) selected cross section as a function of time (0, 60, 120, and 180 min) after charge injection process. Scale bars: 2 µm. Surface potential images of d) silk, e) CDs‐silk without or f) with light irradiation and g) the selected cross sections. Schematic illustration of the process of 2D electron injection to CDs‐silk film h) without and i) with UV illumination using a conductive AFM tip at negative bias.
Figure 5The working principle of CDs‐silk‐based memory device with Ag electrode and the proposed resistive switching mechanism in CDs‐silk‐based memory. a) The SET and RESET operation of a planar Ag/CDs‐silk/Ag device (compliance current: 1 mA, sweeping rate: 50 mV). The inset displays 3D illustration of as‐fabricated planar device. b) SEM images of the planar device before and after SET operation, scale bars: 5 µm. c) An enlarged SEM image of the conductive filament and EDS spectra in different regions. d) The temperature dependence of LRS currents of a vertical Ag/CDs‐silk/ITO device. The devices were measured with constant application of 0.1 V read voltage at 300–400 K. e,f) By application, a positive voltage sweep, the injected charge carrier begin to fill the trapping centers in the CDs‐silk layer. However, the bias (+ 2 V) is not enough to induce a conduction path. In contrast, the charge trapping capacity can be significantly enhanced via photogating effect induced by UV‐irradiation treatment, thus promoting the formation of a conductive path, leading to an abrupt change of device conductivity.