| Literature DB >> 30024928 |
Zhihuai Yu1, Xiu Wang1, Huiyang Bian1, Liang Jiao1, Weibing Wu1, Hongqi Dai1.
Abstract
The continuous development of high electrical equipment towards high power output requires better heat dissipation performance of internal insulation structure. It challenges the traditional paper-based insulating materials, with poor thermal conductivity. Introducing thermally conductive and electrically insulating filler into cellulose-based insulating material can enhance heat conduction performance. This work provided a method to prepare thermally conductive and electrically insulating BN/cellulosic fibre composites. And the thermal conductivity of the composites was remarkably increased via grafting APTES and adding dual-sized fillers. The thermal conductivity of the composite reached 0.682 W/(m•k) that increased by 387% with h-BN loading of 41.08 wt%. Simultaneously, BN fillers improved the insulating properties of the resultant composites. The dielectric constant, breaking strength of and volume resistivity of the composites reached 4.75, 9.2 kV/mm-1 and 4.72×10(14) Ω•m, respectively. The resultant insulating material which has better heat conduction property may have a vast potential for future development in electrical equipment.Entities:
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Year: 2018 PMID: 30024928 PMCID: PMC6053182 DOI: 10.1371/journal.pone.0200842
Source DB: PubMed Journal: PLoS One ISSN: 1932-6203 Impact factor: 3.240
Fig 1The preparation of surface modified h-BN particles.
Fig 2(a)FTIR spectra and (b)TGA curves of pristine h-BN and surface modified h-BN.
Fig 3(a) The thermal conductivity of the composites with different BN fillers (b) Schematic diagram of the hydrogen bond between fillers and cellulosic fibres.
Characteristics of h-BN fillers in different samples.
| Curves | Surface modification | Size (μm) | Ratio (%) |
|---|---|---|---|
| Ⅰ | No | 5 | - |
| Ⅱ | Yes | 5 | - |
| Ⅲ | Yes | 1~2 and 5 | 50 / 50 |
Fig 4Schematic diagram of the filler distribution within the BN/cellulosic fibre composite (a) No heat-conductive pathway at low filler loading (b) Heat-conductive pathways gradually formed at high filler loading (c) More compact and integrated heat-conductive pathways with dual-size filler.
Fig 5The effects of filler loading on (a) Relative permittivity and dielectric loss angle tangent (b) breakdown strength (c) Volume resistivity.
Fig 6SEM images of (a) surface and (b) cross-section of composite with 11.5wt% filler loading; SEM images of (c) surface and (d) cross-section of composite with 41.1wt% filler loading.