Miniemulsion ARGET ATRP via Interfacial and Ion-Pair Catalysis: From ppm to ppb of Residual Copper.

It was recently reported that copper catalysts used in atom transfer radical polymerization (ATRP) can combine with anionic surfactants used in emulsion polymerization to form ion pairs. The ion pairs predominately reside at the surface of the monomer droplets, but they can also migrate inside the droplets and induce a controlled polymerization. This concept was applied to activator regenerated by electron transfer (ARGET) ATRP, with ascorbic acid as reducing agent. ATRP of n-butyl acrylate (BA) and n-butyl methacrylate (BMA) was carried out in miniemulsion using CuII/tris(2-pyridylmethyl)amine (TPMA) as catalyst, with several anionic surfactants forming the reactive ion-pair complexes. The amount and structure of surfactant controlled both the polymerization rate and the final particle size. Well-controlled polymers were prepared with catalyst loadings as low as 50 ppm, leaving only 300 ppb of Cu in the precipitated polymer. Efficient chain extension of a poly(BMA)-Br macroinitiator confirmed high retention of chain-end functionality. This procedure was exploited to prepare polymers with complex architectures such as block copolymers, star polymers, and molecular brushes.