| Literature DB >> 29958406 |
Jiameng Li1, Shiyu Luo2, Jiaxuan Liu3, Hang Xu4, Xian Huang5.
Abstract
Bioresorbable electronics (or transient electronics) devices can be potentially used to replace build-to-last devices in consumer electronics, implantable devices, and data security, leading to reduced electronic waste and surgical processes through controllable dissolution. Recent development of printing bioresorbable electronics leads to bioresorbable conductive pastes or inks that can be used to make interconnects, circuit traces, and sensors, offering alternative solutions for the predominant complementary metal oxide semiconductor (CMOS) processes in fabrication of bioresorbable electronics. However, the conductivities offered by current bioresorbable pastes and processing techniques are still much lower than those of the bulk metals, demanding further improvement in both paste composition and process optimization. This paper aims at exploring several influential factors such as paste compositions and processing techniques in determining conductivities of bioresorbable patterns. Experimental results reveal that an optimized paste constituent with a ratio of Zn:PVP:glycerol:methanol = 7:0.007:2:1 by weight can generate stable conductive pastes suitable for a screen printing process. In addition, a high conductivity of 60,213.6 S/m can be obtained by combining hot rolling and photonic sintering. The results demonstrate that large-scale transient electronics can be obtained by combining screen printing, hot rolling and photonic sintering approaches with optimized paste compositions, offering important experimental proofs and approaches for further improving the conductivity of bioresorbable pastes or inks that can accommodate the demands for mass fabrication and practical use in electronic industry.Entities:
Keywords: bioresorbable electronics; conductive inks; printing electronics techniques
Year: 2018 PMID: 29958406 PMCID: PMC6073384 DOI: 10.3390/ma11071102
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1Schematics of fabricating transient electronic patterns through ink preparation (I), screen printing (II), hot rolling; (III) and photonic sintering; (IV) approaches.
Figure 2(a) The surface morphology of printed patterns using different content of Zn NPs at (I) 10 wt%, (II) 30 wt%, (III) 50 wt%, and (IV) 70 wt%. (V) and (VI) represent that patterns treated without and with hot rolling, respectively. (both of them without photonic sintering). (VIII) and (VII) represent amplified images of (VI) and (V), respectively; (b) The conductivity of patterns using different content of Zn NPs; (c) The conductivity of printed pattern under different treatments.
Figure 3(a) (I) and (II) represent that patterns treated with 20 and 25 light pulses, respectively; (III) a higher resolution of SEM image of surface morphology of Zn NPs after treating with 20 pulses of photonic sintering; (IV) The changes of conductivity with different number of light pulses in the photonic sintering process; (b) The mapping of a printed pattern shows the distribution of Zn (I) and O (II).
Figure 4(a) (I) A printed pattern were bent into different curvatures; (II) The printed pattern as interconnects to connect a LED with a power supply; (III) An LED was lit by a printed interconnect in an extremely curved state; (b) The conductivity of a bioresorbable pattern in different curvatures; (c) Changes in conductivity when a bioresorbable pattern was bent repeatedly from 0 to 0.6 cm−1 in curvature; (d) A dissolution process of a printed pattern.