Literature DB >> 29920799

High-Mobility p-Type and n-Type Copper Nitride Semiconductors by Direct Nitriding Synthesis and In Silico Doping Design.

Kosuke Matsuzaki1, Kou Harada2, Yu Kumagai1, Shogo Koshiya3, Koji Kimoto3, Shigenori Ueda4,5, Masato Sasase1, Akihiro Maeda2, Tomofumi Susaki1,2, Masaaki Kitano1, Fumiyasu Oba1,2,6, Hideo Hosono1,2.   

Abstract

Thin-film photovoltaics (PV) have emerged as a technology that can meet the growing demands for efficient and low-cost large-scale cells. However, the photoabsorbers currently in use contain expensive or toxic elements, and the difficulty in bipolar doping, particularly in a device structure, requires elaborate optimization of the heterostructures for improving the efficiency. This study shows that bipolar doping with high hole and electron mobilities in copper nitride (Cu3 N), composed solely of earth-abundant and environmentally benign elements, is readily available through a novel gaseous direct nitriding reaction applicable to uniform and large-area deposition. A high-quality undoped Cu3 N film is essentially an n-type semiconductor, while p-type conductivity is realized by interstitial fluorine doping, as predicted using density functional theory calculations and directly proven by atomically resolved imaging. The synthetic methodology for high-quality p-type and n-type films paves the way for the application of Cu3 N as an alternative absorber in thin-film PV.
© 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  bipolar doping; direct nitriding; doping design

Year:  2018        PMID: 29920799     DOI: 10.1002/adma.201801968

Source DB:  PubMed          Journal:  Adv Mater        ISSN: 0935-9648            Impact factor:   30.849


  2 in total

1.  Scavenging ROS to Alleviate Acute Liver Injury by ZnO-NiO@COOH.

Authors:  Xuan Wu; Shiyu Liu; Huanhuan Zhu; Zili Ma; Xiaohu Dai; Weiwei Liu
Journal:  Adv Sci (Weinh)       Date:  2022-02-09       Impact factor: 16.806

2.  Enhanced Electrical Properties of Copper Nitride Films Deposited via High Power Impulse Magnetron Sputtering.

Authors:  Yin-Hung Chen; Pei-Ing Lee; Shikha Sakalley; Chao-Kuang Wen; Wei-Chun Cheng; Hui Sun; Sheng-Chi Chen
Journal:  Nanomaterials (Basel)       Date:  2022-08-16       Impact factor: 5.719

  2 in total

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