| Literature DB >> 29461481 |
Antoine Guitton1,2, Hana Kriaa3,4, Emmanuel Bouzy5,6, Julien Guyon7,8, Nabila Maloufi9,10.
Abstract
In this work, plastic deformation was locally introduced at room temperature by nanoindentation on a γ-TiAl-based alloy. Comprehensive analyses of microstructures were performed before and after deformation. In particular, the Burgers vectors, the line directions, and the mechanical twinning systems were studied via accurate electron channeling contrast imaging. Accommodation of the deformation are reported and a scenario is proposed. All features help to explain the poor ductility of the TiAl-based alloys at room temperature.Entities:
Keywords: ECCI; TiAl alloys; dislocation; nanoindentation; twinning
Year: 2018 PMID: 29461481 PMCID: PMC5849002 DOI: 10.3390/ma11020305
Source DB: PubMed Journal: Materials (Basel) ISSN: 1996-1944 Impact factor: 3.623
Figure 1(a) Electron backscattered diffraction (EBSD) orientation map of the zone of interest. (b) Enhanced BSE image showing the microstructure before deformation. The nanoindentation array is localized in the white rectangle. (c,d) EBSD patterns corresponding to grains A and B.
Figure 2Region of interest 1 (ROI1) for which the surface is close to . (a) Accurate electron channeling contrast imaging (aECCI) obtained with showing six Nano-Twins (NTs) and the position of the imprint (transparent Berkovich imprint). The white arrows indicate the trace of the planes. (b) Enhanced BSE image showing the 500 µN indent. Two areas (labelled Areas 1 and 2) have changed. The NT7 slightly visible in (b) comes from a neighbor imprint.
Figure 3ROI2, where the surface plane is near for twin A (left) and near for grain B. The TB corresponds to the system. (a) aECCI obtained with with the transparency position of the Berkovich imprint. The white arrows indicate the trace of the planes. (b) Enhanced BSE image showing two buckling areas (labelled B1 and B2) clearly visible around the 500 µN indent. The blue arrow points to an NT and the yellow to dislocations. (c) 3D schematic of B1 and B2.