Impact of ultrasonic assisted triangular lattice like arranged dispersion of nanoparticles on physical and mechanical properties of epoxy-TiO2 nanocomposites.

Emerging ex-situ technique, ultrasonic dual mixing (UDM) offers unique and hitherto unapproachable opportunities to alter the physical and mechanical properties of polymer nanocomposites. In this study, triangular lattice-like arranged dispersion of TiO2 nanoparticles (average size ∼ 48 nm) in the epoxy polymer has been attained via concurrent use of a probe ultra-sonicator and 4 blades pitched impeller which collectively named as UDM technique. The UDM processing of neat epoxy reveals the generation of triangular lattice-like arranged nanocavities with nanoscale inter-cavity spacing. The UDM processing of epoxy-TiO2 nanocomposites reveals two unique features such as partial and complete entrapping of the nanoparticles by the nanocavities leading the arranged dispersion of particles in the epoxy matrix. Pristine TiO2 nanoparticles were dispersed in the epoxy polymer at loading fractions of up to 20% by weight. The results display that the arranged dispersion of nanoparticles is very effective at enhancing the glass transition temperature (Tg) and tensile properties of the epoxy at loading fractions of 10 wt%. We quantify a direct relationship among three important parameters such as nanoparticle content, cluster size, and inter-particle spacing. Our results offer a novel understanding of these parameters on the Tg and tensile properties of the epoxy nanocomposites. The tensile fracture surfaces revealed several toughening mechanisms such as particle pull-out, plastic void growth, crack deflection, crack bridging and plastic deformation. We show that a strong nanoparticle-matrix interface led to the enhanced mechanical properties due to leading toughening mechanisms such as crack deflection, plastic deformation and particle pull-out. We showed that the UDM has an inordinate prospective to alter the dispersion state of nanoparticles in viscous polymer matrices.