| Literature DB >> 29424026 |
Jiheong Kang1, Donghee Son1,2, Ging-Ji Nathan Wang1, Yuxin Liu1, Jeffrey Lopez1, Yeongin Kim1, Jin Young Oh1, Toru Katsumata1, Jaewan Mun1, Yeongjun Lee1, Lihua Jin1,3, Jeffrey B-H Tok1, Zhenan Bao1.
Abstract
An electronic (e-) skin is expected to experience significant wear and tear over time. Therefore, self-healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e-skin. However, previously reported elastomers and especially self-healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric material crosslinked through rationally designed multistrength hydrogen bonding interactions is reported. The resultant supramolecular network in polymer film realizes exceptional mechanical properties such as notch-insensitive high stretchability (1200%), high toughness of 12 000 J m-2 , and autonomous self-healing even in artificial sweat. The tough self-healing materials enable the wafer-scale fabrication of robust and stretchable self-healing e-skin devices, which will provide new directions for future soft robotics and skin prosthetics.Entities:
Keywords: electronic skin; self-healable electronics; self-healing elastomer; toughness
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Year: 2018 PMID: 29424026 DOI: 10.1002/adma.201706846
Source DB: PubMed Journal: Adv Mater ISSN: 0935-9648 Impact factor: 30.849