Literature DB >> 28948776

Gallium-Based Liquid Metal Amalgams: Transitional-State Metallic Mixtures (TransM2ixes) with Enhanced and Tunable Electrical, Thermal, and Mechanical Properties.

Jianbo Tang1, Xi Zhao, Jing Li, Rui Guo1, Yuan Zhou, Jing Liu1.   

Abstract

Metals are excellent choices for electrical- and thermal-current conducting. However, either the stiffness of solid metals or the fluidity of liquid metals could be troublesome when flexibility and formability are both desired. To address this problem, a reliable two-stage route to improve the functionalities of gallium-based liquid metals is proposed. A series of stable semiliquid/semisolid gallium-based liquid metal amalgams with well-controlled particle packing ratios, which we call TransM2ixes, are prepared and characterized. Through effectively packing the liquid metal with copper particles (which are found to turn into intermetallic compound, CuGa2, after dispersing), remarkable enhancements in electrical conductivity (6 × 106 S m-1, ∼80% increase) and thermal conductivity (50 W m-1 K-1, ∼100% increase) are obtained, making the TransM2ixes stand out from current conductive soft materials. The TransM2ixes also exhibit appealing semiliquid/semisolid mechanical behaviors such as excellent adhesion, tunable formability, and self-healing ability. As a class of highly conductive yet editable metallic mixtures, the TransM2ixes demonstrate potential applications in fields like printed and/or flexible electronics and thermal interface materials, as well as other circumstances where the flexibility and conductivity of interfaces and connections are crucial.

Entities:  

Keywords:  direct-printing electronics; interface materials; liquid metals; metallic dispersions; soft materials

Year:  2017        PMID: 28948776     DOI: 10.1021/acsami.7b10256

Source DB:  PubMed          Journal:  ACS Appl Mater Interfaces        ISSN: 1944-8244            Impact factor:   9.229


  10 in total

Review 1.  Ga-Based Alloys in Microelectronic Interconnects: A Review.

Authors:  Shiqian Liu; Keith Sweatman; Stuart McDonald; Kazuhiro Nogita
Journal:  Materials (Basel)       Date:  2018-08-08       Impact factor: 3.623

2.  Magnetic Liquid Metal (Fe-EGaIn) Based Multifunctional Electronics for Remote Self-Healing Materials, Degradable Electronics, and Thermal Transfer Printing.

Authors:  Rui Guo; Xuyang Sun; Bo Yuan; Hongzhang Wang; Jing Liu
Journal:  Adv Sci (Weinh)       Date:  2019-08-22       Impact factor: 16.806

3.  Is There a Relationship between Surface Wettability of Structured Surfaces and Lyophobicity toward Liquid Metals?

Authors:  Stephan Handschuh-Wang; Lifei Zhu; Tiansheng Gan; Tao Wang
Journal:  Materials (Basel)       Date:  2020-05-15       Impact factor: 3.623

Review 4.  Liquid Metal Based Flexible and Implantable Biosensors.

Authors:  Mingkuan Zhang; Xiaohong Wang; Zhiping Huang; Wei Rao
Journal:  Biosensors (Basel)       Date:  2020-11-10

Review 5.  Pervasive liquid metal printed electronics: From concept incubation to industry.

Authors:  Sen Chen; Jing Liu
Journal:  iScience       Date:  2021-01-05

6.  Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoforming.

Authors:  Jungrak Choi; Chankyu Han; Seokjoo Cho; Kyuyoung Kim; Junseong Ahn; Dionisio Del Orbe; Incheol Cho; Zhi-Jun Zhao; Yong Suk Oh; Hyunsoo Hong; Seong Su Kim; Inkyu Park
Journal:  Sci Adv       Date:  2021-10-13       Impact factor: 14.136

7.  Intrinsically stretchable electronics with ultrahigh deformability to monitor dynamically moving organs.

Authors:  Shaolei Wang; Yuanyuan Nie; Hangyu Zhu; Yurui Xu; Shitai Cao; Jiaxue Zhang; Yanyan Li; Jianhui Wang; Xinghai Ning; Desheng Kong
Journal:  Sci Adv       Date:  2022-03-30       Impact factor: 14.136

Review 8.  Liquid Metal Based Nano-Composites for Printable Stretchable Electronics.

Authors:  Dan Xu; Jinwei Cao; Fei Liu; Shengbo Zou; Wenjuan Lei; Yuanzhao Wu; Yiwei Liu; Jie Shang; Run-Wei Li
Journal:  Sensors (Basel)       Date:  2022-03-25       Impact factor: 3.576

Review 9.  Liquid metal nanocomposites.

Authors:  Mohammad H Malakooti; Michael R Bockstaller; Krzysztof Matyjaszewski; Carmel Majidi
Journal:  Nanoscale Adv       Date:  2020-03-31

Review 10.  Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics.

Authors:  Wenkui Xing; Yue Xu; Chengyi Song; Tao Deng
Journal:  Nanomaterials (Basel)       Date:  2022-09-27       Impact factor: 5.719

  10 in total

北京卡尤迪生物科技股份有限公司 © 2022-2023.