Literature DB >> 28849856

1D copper nanowires for flexible printable electronics and high ampacity wires.

Atif Aziz1, Tan Zhang, Yen-Hao Lin, Farhad Daneshvar, Hung-Jue Sue, Mark Edward Welland.   

Abstract

This paper addresses the synthesis and a detailed electrical analysis of individual copper nanowires (CuNWs). One dimensional CuNWs are chemically grown using bromide ions (Br-) as a co-capping agent. By partially replacing alkyl amines with Br-, the isotropic growth on Cu seeds was suppressed during the synthesis. To study the electrical properties of individual CuNWs, a fabrication method is developed which does not require any e-beam lithography process. Chemically grown CuNWs have an ampacity of about 30 million amps per cm2, which is more than one order of magnitude larger than bulk Cu. These good quality, easy to synthesize CuNWs are excellent candidates for creating high ampacity wires and flexible printable electronics.

Entities:  

Year:  2017        PMID: 28849856     DOI: 10.1039/c7nr02478a

Source DB:  PubMed          Journal:  Nanoscale        ISSN: 2040-3364            Impact factor:   7.790


  4 in total

1.  Percolation effect of a Cu layer on a MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating.

Authors:  Mindaugas Gedvilas; Karolis Ratautas; Aldona Jagminienė; Ina Stankevičienė; Nello Li Pira; Stefano Sinopoli; Elif Kacar; Eugenijus Norkus; Gediminas Račiukaitis
Journal:  RSC Adv       Date:  2018-08-28       Impact factor: 4.036

2.  Facile Synthesis of Ultralong and Thin Copper Nanowires and Its Application to High-Performance Flexible Transparent Conductive Electrodes.

Authors:  Yaxiong Wang; Ping Liu; Baoqing Zeng; Liming Liu; Jianjun Yang
Journal:  Nanoscale Res Lett       Date:  2018-03-07       Impact factor: 4.703

3.  Anisotropic Growth of Copper Nanorods Mediated by Cl- Ions.

Authors:  Min Jia Saw; Mai Thanh Nguyen; Yuji Kunisada; Tomoharu Tokunaga; Tetsu Yonezawa
Journal:  ACS Omega       Date:  2022-02-16

Review 4.  Critical challenges and advances in the carbon nanotube-metal interface for next-generation electronics.

Authors:  Farhad Daneshvar; Hengxi Chen; Kwanghae Noh; Hung-Jue Sue
Journal:  Nanoscale Adv       Date:  2021-01-06
  4 in total

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