Literature DB >> 28682338

Electronics: 3D integration advances computing.

Sherief Reda1.   

Abstract

Mesh：

Year:  2017        PMID： 28682338     DOI： 10.1038/547038a

Source DB:  PubMed          Journal:  Nature        ISSN： 0028-0836            Impact factor:   49.962


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  2 in total

1.  Three-dimensional integration of nanotechnologies for computing and data storage on a single chip.

Authors:  Max M Shulaker; Gage Hills; Rebecca S Park; Roger T Howe; Krishna Saraswat; H-S Philip Wong; Subhasish Mitra
Journal:  Nature       Date:  2017-07-05       Impact factor: 49.962

2.  Carbon nanotube computer.

Authors:  Max M Shulaker; Gage Hills; Nishant Patil; Hai Wei; Hong-Yu Chen; H-S Philip Wong; Subhasish Mitra
Journal:  Nature       Date:  2013-09-26       Impact factor: 49.962
  2 in total
  1 in total

1.  Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding.

Authors:  Zhong Fang; Peng You; Yijie Jia; Xuchao Pan; Yunlei Shi; Junjie Jiao; Yong He
Journal:  Micromachines (Basel)       Date:  2021-12-20       Impact factor: 2.891
  1 in total

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