Literature DB >> 28598586

Nitrogen Photofixation over III-Nitride Nanowires Assisted by Ruthenium Clusters of Low Atomicity.

Lu Li1,2, Yichen Wang2, Srinivas Vanka2, Xiaoyue Mu1, Zetian Mi2,3, Chao-Jun Li1.   

Abstract

In many heterogeneous catalysts, the interaction of supported metal species with a matrix can alter the electronic and morphological properties of the metal and manipulate its catalytic properties. III-nitride semiconductors have a unique ability to stabilize ultra-small ruthenium (Ru) clusters (ca. 0.8 nm) at a high loading density up to 5 wt %. n-Type III-nitride nanowires decorated with Ru sub-nanoclusters offer controlled surface charge properties and exhibit superior UV- and visible-light photocatalytic activity for ammonia synthesis at ambient temperature. A metal/semiconductor interfacial Schottky junction with a 0.94 eV barrier height can greatly facilitate photogenerated electron transfer from III-nitrides to Ru, rendering Ru an electron sink that promotes N≡N bond cleavage, and thereby achieving low-temperature ammonia synthesis.
© 2017 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim.

Entities:  

Keywords:  Schottky barrier; ammonia synthesis; metal nitrides; photocatalysis; ruthenium clusters

Year:  2017        PMID: 28598586     DOI: 10.1002/anie.201703301

Source DB:  PubMed          Journal:  Angew Chem Int Ed Engl        ISSN: 1433-7851            Impact factor:   15.336


  3 in total

1.  Highly efficient binary copper-iron catalyst for photoelectrochemical carbon dioxide reduction toward methane.

Authors:  Baowen Zhou; Pengfei Ou; Nick Pant; Shaobo Cheng; Srinivas Vanka; Sheng Chu; Roksana Tonny Rashid; Gianluigi Botton; Jun Song; Zetian Mi
Journal:  Proc Natl Acad Sci U S A       Date:  2020-01-03       Impact factor: 11.205

Review 2.  A minireview on catalysts for photocatalytic N2 fixation to synthesize ammonia.

Authors:  Ping Qi; Xiaoxu Gao; Jian Wang; Huimin Liu; Dehua He; Qijian Zhang
Journal:  RSC Adv       Date:  2022-01-14       Impact factor: 3.361

3.  Photo-assisted sequential assembling of uniform metal nanoclusters on semiconductor support.

Authors:  Haocheng Wu; Wentao Jiang; Liyi Shi; Rengui Li; Lei Huang; Can Li
Journal:  iScience       Date:  2021-12-04
  3 in total

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