High speed cleaving of crystals with ultrafast Bessel beams.

We develop a novel concept for ultra-high speed cleaving of crystalline materials with femtosecond lasers. Using Bessel beams in single shot, fracture planes can be induced nearly all along the Bessel zone in sapphire. For the first time, we show that only for a pulse duration below 650 fs, a single fracture can be induced in sapphire, while above this duration, cracks appear in all crystallographic orientations. We determine the influential parameters which are polarization direction, crystallographic axes and scanning direction. This is applied to cleave sapphire with a spacing as high as 25 μm between laser impacts.