| Literature DB >> 28157329 |
Manuela Loeblein1,2, Siu Hon Tsang3, Matthieu Pawlik1, Eric Jian Rong Phua3, Han Yong2, Xiao Wu Zhang2, Chee Lip Gan3, Edwin Hang Tong Teo.
Abstract
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1 K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).Entities:
Keywords: hot-spot removal; nano−thermal interface material; thermal management; three-dimensional graphene; three-dimensional h-BN
Year: 2017 PMID: 28157329 DOI: 10.1021/acsnano.6b08218
Source DB: PubMed Journal: ACS Nano ISSN: 1936-0851 Impact factor: 15.881