| Literature DB >> 27775088 |
Jiyuan Zheng1, Lai Wang1, Di Yang1, Jiadong Yu1, Xiao Meng1, Zhibiao Hao1, Changzheng Sun1, Bing Xiong1, Yi Luo1, Yanjun Han1, Jian Wang1, Hongtao Li1, Mo Li2, Qian Li2.
Abstract
In ultra-high sensitive APDs, a vibrate of temperature might bring a fatal decline of the multiplication performance. Conventional method to realize a temperature-stable APD focuses on the optimization of device structure, which has limited effects. While in this paper, a solution by reducing the carrier scattering rate based on an GaN/AlN periodically-stacked structure (PSS) APD is brought out to improve temperature stability essentially. Transport property is systematically investigated. Compared with conventional GaN homojunction (HJ) APDs, electron suffers much less phonon scatterings before it achieves ionization threshold energy and more electrons occupy high energy states in PSS APD. The temperature dependence of ionization coefficient and energy distribution is greatly reduced. As a result, temperature stability on gain is significantly improved when the ionization happens with high efficiency. The change of gain for GaN (10 nm)/AlN (10 nm) PSS APD from 300 K to 310 K is about 20% lower than that for HJ APD. Additionally, thicker period length is found favorable to ionization coefficient ratio but a bit harmful to temperature stability, while increasing the proportion of AlN at each period in a specific range is found favorable to both ionization coefficient ratio and temperature stability.Entities:
Year: 2016 PMID: 27775088 PMCID: PMC5075870 DOI: 10.1038/srep35978
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Figure 1Motivation of the PSS structure.
(a) In conventional HJ APD, most of the energy drawn from electric field is thermalized during electron and hole transport. (b) In PSS APD, the scattering degree during electron transport is greatly reduced.
Figure 2Electron transport properties for AlN (10 nm)/GaN (10 nm) PSS APD and GaN HJ APD.
(a) S simulated under different electric field for PSS APD and HJ APD in 300 K. (b,c) Conduction band occupancy of electron in (b) GaN HJ APD and (c) GaN layers in GaN/AlN PSS APD under different electric field in 300 K. (d) Energy distribution curves of HJ APD and PSS APD under electric field of 1.8 MV/cm.
Figure 3Temperature dependent properties for electron transport.
(a) Temperature dependent properties of for HJ APD and PSS APD under electric field of 3.2 MV/cm. (b,c) Temperature dependent properties of energy distribution curves for (b) HJ APD and (c) PSS APD under electric field of 1.8 MV/cm.
Figure 4Carriers’ ionization coefficients and temperature dependent features for PSS APD and HJ APD.
(a) Ionization coefficients of electron and hole under various electric field for PSS APD and HJ APD in 300 K. (b) Temperature dependence for carrier’s ionization coefficient for PSS APD and HJ APD under electric field of 3.2 MV/cm. (c) Temperature dependent ionization coefficients in (b) are normalized to the values under 300 K. (d) A comparison of the descent degree for gains with temperature between HJ APD and PSS APD.
Figure 5The influences of period length and layer thickness on ionization performance and temperature stability.
(a) simulated under different electric fields at 300 K. (b) Ionization coefficients of electron and hole under various electric fields for PSS APDs at 300 K. (c) Ionization probability at each period for electron and hole under various electric fields at 300 K. (d) Temperature-dependent gains for different structures.