Ultrafast cooling by covalently bonded graphene-carbon nanotube hybrid immersed in water.

The increasing power density and the decreasing dimensions of transistors present severe thermal challenges to the design of modern microprocessors. Furthermore, new technologies such as three-dimensional chip-stack architectures require novel cooling solutions for their thermal management. Here, we demonstrate, through transient heat-dissipation simulations, that a covalently bonded graphene-carbon nanotube (G-CNT) hybrid immersed in water is a promising solution for the ultrafast cooling of such high-temperature and high heat-flux surfaces. The G-CNT hybrid offers a unique platform to integrate the superior axial heat transfer capability of individual CNTs via their parallel arrangement. The immersion of the G-CNT in water enables an additional heat dissipation path via the solid-liquid interaction, allowing for the sustainable cooling of the hot surface under a constant power input of up to 10 000 W cm-2.