Literature DB >> 27609989

Design of Stretchable Electronics Against Impact.

J H Yuan1, M Pharr2, X Feng1, John A Rogers2, Yonggang Huang3.   

Abstract

Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.

Entities:  

Keywords:  impact loading; stretchable electronics; viscoelasticity

Year:  2016        PMID: 27609989      PMCID: PMC4992949          DOI: 10.1115/1.4034226

Source DB:  PubMed          Journal:  J Appl Mech        ISSN: 0021-8936            Impact factor:   2.168


  7 in total

Review 1.  Materials and mechanics for stretchable electronics.

Authors:  John A Rogers; Takao Someya; Yonggang Huang
Journal:  Science       Date:  2010-03-26       Impact factor: 47.728

2.  A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates.

Authors:  Dahl-Young Khang; Hanqing Jiang; Young Huang; John A Rogers
Journal:  Science       Date:  2005-12-15       Impact factor: 47.728

3.  Conformal piezoelectric systems for clinical and experimental characterization of soft tissue biomechanics.

Authors:  Canan Dagdeviren; Yan Shi; Pauline Joe; Roozbeh Ghaffari; Guive Balooch; Karan Usgaonkar; Onur Gur; Phat L Tran; Jessi R Crosby; Marcin Meyer; Yewang Su; R Chad Webb; Andrew S Tedesco; Marvin J Slepian; Yonggang Huang; John A Rogers
Journal:  Nat Mater       Date:  2015-05-18       Impact factor: 43.841

4.  Phase Diagrams of Instabilities in Compressed Film-Substrate Systems.

Authors:  Qiming Wang; Xuanhe Zhao
Journal:  J Appl Mech       Date:  2013-12-10       Impact factor: 2.168

5.  A Mechanics Model for Sensors Imperfectly Bonded to the Skin for Determination of the Young's Moduli of Epidermis and Dermis.

Authors:  J H Yuan; Y Shi; M Pharr; X Feng; John A Rogers; Yonggang Huang
Journal:  J Appl Mech       Date:  2016-05-30       Impact factor: 2.168

6.  Soft network composite materials with deterministic and bio-inspired designs.

Authors:  Kyung-In Jang; Ha Uk Chung; Sheng Xu; Chi Hwan Lee; Haiwen Luan; Jaewoong Jeong; Huanyu Cheng; Gwang-Tae Kim; Sang Youn Han; Jung Woo Lee; Jeonghyun Kim; Moongee Cho; Fuxing Miao; Yiyuan Yang; Han Na Jung; Matthew Flavin; Howard Liu; Gil Woo Kong; Ki Jun Yu; Sang Il Rhee; Jeahoon Chung; Byunggik Kim; Jean Won Kwak; Myoung Hee Yun; Jin Young Kim; Young Min Song; Ungyu Paik; Yihui Zhang; Yonggang Huang; John A Rogers
Journal:  Nat Commun       Date:  2015-03-18       Impact factor: 14.919

7.  Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism.

Authors:  Barbara Putz; Oleksandr Glushko; Megan J Cordill
Journal:  Mater Res Lett       Date:  2015-10-27       Impact factor: 7.323

  7 in total

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