Literature DB >> 27499728

Guided Formation of 3D Helical Mesostructures by Mechanical Buckling: Analytical Modeling and Experimental Validation.

Yuan Liu1, Zheng Yan2, Qing Lin2, Xuelin Guo2, Mengdi Han3, Kewang Nan2, Keh-Chih Hwang1, Yonggang Huang4, Yihui Zhang1, John A Rogers5.   

Abstract

Three-dimensional (3D) helical mesostructures are attractive for applications in a broad range of microsystem technologies, due to their mechanical and electromagnetic properties as stretchable interconnects, radio frequency antennas and others. Controlled compressive buckling of 2D serpentine-shaped ribbons provides a strategy to formation of such structures in wide ranging classes of materials (from soft polymers to brittle inorganic semiconductors) and length scales (from nanometer to centimeter), with an ability for automated, parallel assembly over large areas. The underlying relations between the helical configurations and fabrication parameters require a relevant theory as the basis of design for practical applications. Here, we present an analytic model of compressive buckling in serpentine microstructures, based on the minimization of total strain energy that results from various forms of spatially dependent deformations. Experiments at micro- and millimeter-scales, together with finite element analyses (FEA), were exploited to examine the validity of developed model. The theoretical analyses shed light on general scaling laws in terms of three groups of fabrication parameters (related to loading, material and 2D geometry), including a negligible effect of material parameters and a square root dependence of primary displacements on the compressive strain. Furthermore, analytic solutions were obtained for the key physical quantities (e.g., displacement, curvature and maximum strain). A demonstrative example illustrates how to leverage the analytic solutions in choosing the various design parameters, such that brittle fracture or plastic yield can be avoided in the assembly process.

Entities:  

Keywords:  Buckling; Helix; Modeling; Serpentine Structures; Three-dimensional Assembly

Year:  2016        PMID: 27499728      PMCID: PMC4972031          DOI: 10.1002/adfm.201505132

Source DB:  PubMed          Journal:  Adv Funct Mater        ISSN: 1616-301X            Impact factor:   18.808


  27 in total

1.  Origami tubes assembled into stiff, yet reconfigurable structures and metamaterials.

Authors:  Evgueni T Filipov; Tomohiro Tachi; Glaucio H Paulino
Journal:  Proc Natl Acad Sci U S A       Date:  2015-09-08       Impact factor: 11.205

2.  Controlled 3D buckling of silicon nanowires for stretchable electronics.

Authors:  Feng Xu; Wei Lu; Yong Zhu
Journal:  ACS Nano       Date:  2010-12-28       Impact factor: 15.881

3.  Soft-lithographic replication of 3D microstructures with closed loops.

Authors:  Christopher N LaFratta; Linjie Li; John T Fourkas
Journal:  Proc Natl Acad Sci U S A       Date:  2006-05-23       Impact factor: 11.205

4.  Shaping of elastic sheets by prescription of non-Euclidean metrics.

Authors:  Yael Klein; Efi Efrati; Eran Sharon
Journal:  Science       Date:  2007-02-23       Impact factor: 47.728

5.  Gold helix photonic metamaterial as broadband circular polarizer.

Authors:  Justyna K Gansel; Michael Thiel; Michael S Rill; Manuel Decker; Klaus Bade; Volker Saile; Georg von Freymann; Stefan Linden; Martin Wegener
Journal:  Science       Date:  2009-08-20       Impact factor: 47.728

6.  Algorithmic lattice kirigami: A route to pluripotent materials.

Authors:  Daniel M Sussman; Yigil Cho; Toen Castle; Xingting Gong; Euiyeon Jung; Shu Yang; Randall D Kamien
Journal:  Proc Natl Acad Sci U S A       Date:  2015-05-26       Impact factor: 11.205

7.  Making the cut: lattice kirigami rules.

Authors:  Toen Castle; Yigil Cho; Xingting Gong; Euiyeon Jung; Daniel M Sussman; Shu Yang; Randall D Kamien
Journal:  Phys Rev Lett       Date:  2014-12-11       Impact factor: 9.161

8.  Materials science. Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling.

Authors:  Sheng Xu; Zheng Yan; Kyung-In Jang; Wen Huang; Haoran Fu; Jeonghyun Kim; Zijun Wei; Matthew Flavin; Joselle McCracken; Renhan Wang; Adina Badea; Yuhao Liu; Dongqing Xiao; Guoyan Zhou; Jungwoo Lee; Ha Uk Chung; Huanyu Cheng; Wen Ren; Anthony Banks; Xiuling Li; Ungyu Paik; Ralph G Nuzzo; Yonggang Huang; Yihui Zhang; John A Rogers
Journal:  Science       Date:  2015-01-09       Impact factor: 47.728

9.  Nanomaterial-enabled stretchable conductors: strategies, materials and devices.

Authors:  Shanshan Yao; Yong Zhu
Journal:  Adv Mater       Date:  2015-01-26       Impact factor: 30.849

10.  Fabrication of three-dimensional helical microchannels with arbitrary length and uniform diameter inside fused silica.

Authors:  Shengguan He; Feng Chen; Keyin Liu; Qing Yang; Hewei Liu; Hao Bian; Xiangwei Meng; Chao Shan; Jinhai Si; Yulong Zhao; Xun Hou
Journal:  Opt Lett       Date:  2012-09-15       Impact factor: 3.776

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  13 in total

Review 1.  Design and application of 'J-shaped' stress-strain behavior in stretchable electronics: a review.

Authors:  Yinji Ma; Xue Feng; John A Rogers; Yonggang Huang; Yihui Zhang
Journal:  Lab Chip       Date:  2017-05-16       Impact factor: 6.799

2.  Postbuckling analyses of frame mesostructures consisting of straight ribbons for mechanically guided three-dimensional assembly.

Authors:  Yuan Liu; Zheng Xu; Keh-Chi Hwang; Yonggang Huang; Yihui Zhang
Journal:  Proc Math Phys Eng Sci       Date:  2019-05-29       Impact factor: 2.704

3.  Harnessing the interface mechanics of hard films and soft substrates for 3D assembly by controlled buckling.

Authors:  Yuan Liu; Xueju Wang; Yameng Xu; Zhaoguo Xue; Yi Zhang; Xin Ning; Xu Cheng; Yeguang Xue; Di Lu; Qihui Zhang; Fan Zhang; Jianxing Liu; Xiaogang Guo; Keh-Chih Hwang; Yonggang Huang; John A Rogers; Yihui Zhang
Journal:  Proc Natl Acad Sci U S A       Date:  2019-07-17       Impact factor: 11.205

4.  Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses.

Authors:  Haoran Fu; Kewang Nan; Paul Froeter; Wen Huang; Yuan Liu; Yiqi Wang; Juntong Wang; Zheng Yan; Haiwen Luan; Xiaogang Guo; Yijie Zhang; Changqing Jiang; Luming Li; Alison C Dunn; Xiuling Li; Yonggang Huang; Yihui Zhang; John A Rogers
Journal:  Small       Date:  2017-05-10       Impact factor: 13.281

5.  Soft Elastomers with Ionic Liquid-Filled Cavities as Strain Isolating Substrates for Wearable Electronics.

Authors:  Yinji Ma; Matt Pharr; Liang Wang; Jeonghyun Kim; Yuhao Liu; Yeguang Xue; Rui Ning; Xiufeng Wang; Ha Uk Chung; Xue Feng; John A Rogers; Yonggang Huang
Journal:  Small       Date:  2016-12-27       Impact factor: 13.281

Review 6.  Integration of biological systems with electronic-mechanical assemblies.

Authors:  Ning Yi; Haitao Cui; Lijie Grace Zhang; Huanyu Cheng
Journal:  Acta Biomater       Date:  2019-04-17       Impact factor: 8.947

7.  Three-Dimensional Multiscale, Multistable, and Geometrically Diverse Microstructures with Tunable Vibrational Dynamics Assembled by Compressive Buckling.

Authors:  Xin Ning; Heling Wang; Xinge Yu; Julio A N T Soares; Zheng Yan; Kewang Nan; Gabriel Velarde; Yeguang Xue; Rujie Sun; Qiyi Dong; Haiwen Luan; Chan Mi Lee; Aditya Chempakasseril; Mengdi Han; Yiqi Wang; Luming Li; Yonggang Huang; Yihui Zhang; John Rogers
Journal:  Adv Funct Mater       Date:  2017-03-03       Impact factor: 18.808

8.  Engineered elastomer substrates for guided assembly of complex 3D mesostructures by spatially nonuniform compressive buckling.

Authors:  Kewang Nan; Haiwen Luan; Zheng Yan; Xin Ning; Yiqi Wang; Ao Wang; Juntong Wang; Mengdi Han; Matthew Chang; Kan Li; Yutong Zhang; Wen Huang; Yeguang Xue; Yonggang Huang; Yihui Zhang; John A Rogers
Journal:  Adv Funct Mater       Date:  2016-11-02       Impact factor: 18.808

9.  Vibration of Mechanically-Assembled 3D Microstructures Formed by Compressive Buckling.

Authors:  Heling Wang; Xin Ning; Haibo Li; Haiwen Luan; Yeguang Xue; Xinge Yu; Zhichao Fan; Luming Li; John A Rogers; Yihui Zhang; Yonggang Huang
Journal:  J Mech Phys Solids       Date:  2017-12-08       Impact factor: 5.471

10.  Thermal Release Transfer Printing for Stretchable Conformal Bioelectronics.

Authors:  Zhuocheng Yan; Taisong Pan; Miaomiao Xue; Changyong Chen; Yan Cui; Guang Yao; Long Huang; Feiyi Liao; Wei Jing; Hulin Zhang; Min Gao; Daqing Guo; Yang Xia; Yuan Lin
Journal:  Adv Sci (Weinh)       Date:  2017-07-31       Impact factor: 16.806

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