| Literature DB >> 27461889 |
Xiaobing Liu1, Xin Chen1, Hong-An Ma2, Xiaopeng Jia2, Jinsong Wu3, Tony Yu4, Yanbin Wang4, Jiangang Guo5, Sylvain Petitgirard6, Craig R Bina1, Steven D Jacobsen1.
Abstract
Materials combining the hardness and strength of diamond with the higher thermal stability ofEntities:
Year: 2016 PMID: 27461889 PMCID: PMC4962311 DOI: 10.1038/srep30518
Source DB: PubMed Journal: Sci Rep ISSN: 2045-2322 Impact factor: 4.379
Synthesis conditions and electrical properties of nanopolycrystalline C -BN composites.
| Run | Sample | P (GPa) | T (K) | Resistivity (Ωcm) | Hall mobility (cm2/VS) | Carrier concentration (cm−3) | |
|---|---|---|---|---|---|---|---|
| Sintered-BN | 7.5 | 2273 | / | / | / | / | |
| C2-BN | 7.5 | 2273 | 1.652 | 37.55 | 1.006E17 | ||
| C4-BN | 7.5 | 2273 | 0.162 | 2.67 | 1.439E19 | ||
| C6-BN | 7.5 | 2273 | 0.571 | 364.69 | 2.999E16 | ||
| C8-BN | 7.5 | 2273 | 0.055 | 46.62 | 2.426E18 | ||
| Sintered-C | 7.5 | 2273 | 0.014 | 15.68 | 2.749E19 | ||
| Single-crystal diamond | 5-5.5 | 1500 | / | / | / | / | |
| Single-crystal | 4.8 | 1400 | / | / | / | / | |
| Microcrystalline samples | |||||||
| C2-BN (microcrystalline) | 7.5 | 2273 | 6.38 | 6.55 | 1.490 E16 | ||
| C2-BN (microcrystalline) | 7.5 | 1800 | 1064 | 162 | 3.624 E14 | ||
Temperature was held constant for two hours. The C-BN composites consist of sintered nanodiamond (50 nm) and cBN (250 nm) with varying ratios (x) of diamond to cBN. For comparison, microcrystalline C2-BN composites from two different synthesis temperatures demonstrate the decrease in resistivity with increasing temperature between 1800 and 2273 K.
Figure 1Characterization of C2-BN synthesized at 7.5 GPa and 2273 K.
(a) XRD and (b) Raman spectra indicate two components, diamond and cBN. Rings in the CCD image (top-right inset in 1a) show the polycrystalline texture of well-sintered C2-BN composite.
Figure 2Microstructure of nanocomposite C2-BN.
(a) TEM lamellae obtained from a C2-BN bulk sample before focused ion-beam (FIB) thinning. (b,c) TEM images of the area with the red box in (a). The inset of (b) shows a selected area diffraction (SAED) pattern (d and e) HRTEM images of the nanotwinned diamond and cBN domains. Insets show calculated FFT patterns of the two main domains.
Figure 3Ultrahard sutures in nanocomposite C2-BN.
(a–c) HRTEM images at the junction between diamond and cBN domains. The FFT inset shows the rotation angles between adjacent diamond or cBN domains. (d) HRTEM and corresponding SAED pattern from a typical junction indicates that only nano-twinned diamond and cBN are present at the interface. Dislocations and stacking faults at the interface are found in the region marked by the white rectangle in (b) and (d).
Figure 4Evidence for sp3-hybridized C-B and C-N in nanocomposite C2-BN.
(a) HRTEM image of C2-BN (b) EELS taken from C2-BN along the suture between diamond and cBN domains. EELS data were collected with a beam approximately 1 × 1 nm in size. Symbols π* and σ* correspond to sp2 and sp3 bonding, respectively. (c–e) XPS spectra of B, C, and N 1s core levels, respectively. The spectra (red circles) are deconvolved (colored curves) by Gaussian fitting.
Figure 5Mechanical and electrical properties of C2-BN nanocomposite.
(a) H of C2-BN as a function of applied load. Left inset: Optical micrograph of an indentation in C2-BN produced by a load of 19.6 N. Right inset images in (a) show profiles across d1 and d2 measured using a 3D microscope. (b) H as a function of composition for C-BN materials. For comparison, we measured the Vickers hardness of C-BN with higher diamond:cBN ratios at only the highest load of 19.6 N. The measured indentation hardness of C-BN ranged from 40 GPa to 85 GPa. (c), Thermogravimetric data (in air) for C2-BN (the onset temperature of oxidation T is 1183 K) and boron-doped diamond single crystals (T~1027 K). (d) A resistance-versus-temperature curve for C2-BN measuring 2 × 2 mm and 1 mm thick. The inset in (d) shows ln (R) as a function of T−1 in the temperature range from 50 to 100 K. The linear fit (solid line) shows that the data are well described by R(T) ∝ exp(Eg/kBT), where Eg is the activation energy and kB is Boltzmann’s constant.