| Literature DB >> 27435480 |
Do Hyun Kim1, Hyeon Gyun Yoo1, Sung Min Hong2, Bongkyun Jang2, Dae Yong Park1, Daniel J Joe1, Jae-Hyun Kim3, Keon Jae Lee4.
Abstract
Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.Entities:
Keywords: flexible ACF packaging; flexible NAND flash memory; roll-to-plate technology; ultrathin silicon-based flexible electronics
Year: 2016 PMID： 27435480 DOI： 10.1002/adma.201602339
Source DB: PubMed Journal: Adv Mater ISSN： 0935-9648 Impact factor: 30.849