| Literature DB >> 27185932 |
Mark A Skylar-Scott1, Suman Gunasekaran2, Jennifer A Lewis3.
Abstract
The ability to pattern planar and freestanding 3D metallic architectures at the microscale would enable myriad applications, including flexible electronics, displays, sensors, and electrically small antennas. A 3D printing method is introduced that combines direct ink writing with a focused laser that locally anneals printed metallic features "on-the-fly." To optimize the nozzle-to-laser separation distance, the heat transfer along the printed silver wire is modeled as a function of printing speed, laser intensity, and pulse duration. Laser-assisted direct ink writing is used to pattern highly conductive, ductile metallic interconnects, springs, and freestanding spiral architectures on flexible and rigid substrates.Keywords: 3D printing; conductive interconnects; flexible electronics; laser annealing; silver ink
Year: 2016 PMID: 27185932 PMCID: PMC4896727 DOI: 10.1073/pnas.1525131113
Source DB: PubMed Journal: Proc Natl Acad Sci U S A ISSN: 0027-8424 Impact factor: 11.205